Target material binding method

A target material and non-magnetic metal technology, which is applied in metal material coating process, ion implantation plating, coating, etc., can solve the problems of non-reusable, solder waste, high cost of target material, etc., to increase electrical and thermal conductivity, Effects of reducing cost and controlling the thickness of welding layer

Active Publication Date: 2015-09-23
HANERGY MOBILE ENERGY HLDG GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the implementation of this method, the waste of solder will be caused due to the adhesion of the solder to the fabric when the fabric passes over the solder, and the fab

Method used

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  • Target material binding method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] Example 1

[0031] Complete the alignment according to the following steps figure 1 The binding of the target material of the structure shown:

[0032] (1) Use absolute ethanol to clean the welding surface of target 1 and back plate 2;

[0033] (2) Add 60% by weight of aluminum powder to the epoxy resin glue to make conductive glue 3, wherein the particle size of the aluminum powder is 1-120 μm;

[0034] (3) The conductive adhesive 3 is evenly coated on the welding surface of the target 1 and the back plate 2 and both sides of the copper mesh 4, wherein the mesh size of the copper mesh 4 is 20 mesh, and the copper The diameter of the net wire of net 4 is 0.15mm;

[0035] (4) The copper mesh 4 and the target material 1 are sequentially stacked and positioned on the welding surface of the back plate 2, and the copper mesh 4 is located between the welding surface of the target material 1 and the back plate 2;

[0036] (5) Place a compact on the target material 1, and stand and solid...

Example Embodiment

[0039] Example 2

[0040] Complete the alignment according to the following steps figure 1 The binding of the target material of the structure shown:

[0041] (1) Use isopropanol to clean the welding surface of target 1 and back plate 2;

[0042] (2) Add 60% by weight of aluminum powder to the epoxy resin glue to make conductive glue 3, wherein the particle size of the aluminum powder is 1-120 μm;

[0043] (3) The conductive adhesive 3 is evenly coated on the welding surface of the target 1 and the back plate 2 and both sides of the copper mesh 4, wherein the mesh size of the copper mesh 4 is 22 meshes, and the copper mesh The diameter of the net wire of net 4 is 0.15mm;

[0044] (4) The copper mesh 4 and the target material 1 are sequentially stacked and positioned on the welding surface of the back plate 2, and the copper mesh 4 is located between the welding surface of the target material 1 and the back plate 2;

[0045] (5) Place a compact on the target material 1, and stand and sol...

Example Embodiment

[0047] Example 3

[0048] The difference from Example 1 is that the mesh size of the copper mesh 4 is 24 mesh.

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Abstract

The invention discloses a target material binding method; a non-magnetic metal net with the sieve hole size of 20-120 mesh is arranged in a welding layer between a target material and a backing plate, so as to effectively eliminate or splitting large bubbles existing in the welding layer, greatly increase the binding rate of the target material, and effectively avoid target material missing risk caused because the large bubbles are accumulated in the welding layer due to heat in the target material use process; at the same time, the presence of the non-magnetic metal net can also increase the electrical and thermal conductivity and heat resistance of the welding layer, and plays a buffering role and a welding layer thickness controlling role. The method has the advantages of simple process, easy obtained raw material and low cost, and the obtained product has good reliability and has broad application prospects.

Description

technical field [0001] The invention relates to a target processing method, in particular to a target binding method. Background technique [0002] At present, the targets used in the sputtering coating industry are usually manufactured by diffusion bonding or adhesive bonding. Since the targets are used in a low-potential sputtering environment, the bonding adhesive Junction materials must be conductive and non-magnetic. At present, indium or indium alloys, tin or tin alloys are usually used as bonding materials in the industry. In addition, in order to strengthen the bonding force between the target and the back plate, mechanical auxiliary components are usually added during the binding process, such as conductive blankets, metal spring clips, threaded fittings, tight fittings (hot press fittings), Extrusion and press-fitting are used to strengthen the firmness of the target binding. [0003] The U.S. patent application publication number US2009 / 0250337A1 discloses a met...

Claims

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Application Information

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IPC IPC(8): C23C14/34B23K31/02
Inventor 林俊荣梁敏敏祝令建王玉晓
Owner HANERGY MOBILE ENERGY HLDG GRP CO LTD
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