Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Target material binding method

A target material and non-magnetic metal technology, which is applied in metal material coating process, ion implantation plating, coating, etc., can solve the problems of non-reusable, solder waste, high cost of target material, etc., to increase electrical and thermal conductivity, Effects of reducing cost and controlling the thickness of welding layer

Active Publication Date: 2015-09-23
HANERGY MOBILE ENERGY HLDG GRP CO LTD
View PDF4 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the implementation of this method, the waste of solder will be caused due to the adhesion of the solder to the fabric when the fabric passes over the solder, and the fabric to which the solder is adhered will not be able to be used again or because the gap is blocked. Requires secondary processing before reuse, resulting in high cost of target binding

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Target material binding method
  • Target material binding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Follow the steps below to complete the figure 1 Binding of targets of the structures shown:

[0032] (1) Clean the welding surfaces of the target 1 and the back plate 2 with absolute ethanol;

[0033] (2) adding 60% by weight aluminum powder to the epoxy resin glue to make conductive glue 3, wherein the particle size of the aluminum powder is 1-120 μm;

[0034] (3) The conductive adhesive 3 is evenly coated on the welding surface of the target 1 and the back plate 2 and both sides of the copper mesh 4, wherein the mesh size of the copper mesh 4 is 20 mesh, and the copper mesh 4 The wire diameter of the net 4 is 0.15mm;

[0035] (4) The copper mesh 4 and the target material 1 are sequentially stacked on the welding surface of the back plate 2 and positioned, and the copper mesh 4 is located between the welding surface of the target material 1 and the back plate 2;

[0036] (5) Place a briquette on the target 1, and stand and solidify at normal temperature and pressure...

Embodiment 2

[0040] Follow the steps below to complete the figure 1 Binding of targets of the structures shown:

[0041] (1) Clean the welding surfaces of the target 1 and the back plate 2 with isopropanol;

[0042] (2) adding 60% by weight aluminum powder to the epoxy resin glue to make conductive glue 3, wherein the particle size of the aluminum powder is 1-120 μm;

[0043] (3) The conductive adhesive 3 is evenly coated on the welding surface of the target 1 and the back plate 2 and both sides of the copper mesh 4, wherein the mesh size of the copper mesh 4 is 22 mesh, and the copper mesh 4 The wire diameter of the net 4 is 0.15mm;

[0044] (4) The copper mesh 4 and the target material 1 are sequentially stacked on the welding surface of the back plate 2 and positioned, and the copper mesh 4 is located between the welding surface of the target material 1 and the back plate 2;

[0045] (5) Place a briquette on the target 1, and stand and solidify at normal temperature and pressure to o...

Embodiment 3

[0048] It differs from Example 1 in that: the mesh size of the copper mesh 4 is 24 mesh.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention discloses a target material binding method; a non-magnetic metal net with the sieve hole size of 20-120 mesh is arranged in a welding layer between a target material and a backing plate, so as to effectively eliminate or splitting large bubbles existing in the welding layer, greatly increase the binding rate of the target material, and effectively avoid target material missing risk caused because the large bubbles are accumulated in the welding layer due to heat in the target material use process; at the same time, the presence of the non-magnetic metal net can also increase the electrical and thermal conductivity and heat resistance of the welding layer, and plays a buffering role and a welding layer thickness controlling role. The method has the advantages of simple process, easy obtained raw material and low cost, and the obtained product has good reliability and has broad application prospects.

Description

technical field [0001] The invention relates to a target processing method, in particular to a target binding method. Background technique [0002] At present, the targets used in the sputtering coating industry are usually manufactured by diffusion bonding or adhesive bonding. Since the targets are used in a low-potential sputtering environment, the bonding adhesive Junction materials must be conductive and non-magnetic. At present, indium or indium alloys, tin or tin alloys are usually used as bonding materials in the industry. In addition, in order to strengthen the bonding force between the target and the back plate, mechanical auxiliary components are usually added during the binding process, such as conductive blankets, metal spring clips, threaded fittings, tight fittings (hot press fittings), Extrusion and press-fitting are used to strengthen the firmness of the target binding. [0003] The U.S. patent application publication number US2009 / 0250337A1 discloses a met...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C14/34B23K31/02
Inventor 林俊荣梁敏敏祝令建王玉晓
Owner HANERGY MOBILE ENERGY HLDG GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com