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Low-temperature lead-free solder

A lead-free solder, low temperature technology, used in the field of soldering materials, electrical contact materials, and low temperature soldering in the electronic industry, can solve the performance of electrical contact materials (hardness, welding resistance, corrosion resistance, reliability, stability, etc.) The performance, accuracy and service life are not greatly improved, and the volume change of the solid-liquid phase is not large, the welding needs are met, and the contact is good.

Active Publication Date: 2018-12-11
YUNNAN KEWEI LIQUID METAL VALLEY R & D CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the cost is saved compared with traditional materials, the performance of electrical contact materials (hardness, welding resistance, corrosion resistance, reliability, stability, precision and service life, etc.) has not been greatly improved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Embodiment 1 low temperature lead-free solder

[0037] Formula: Bi 40%, Sn 35%, Zn 0.2%, Al 0.15%, Cu 0.1%, P0.15% by mass percentage, and the rest is In.

[0038] Preparation:

[0039] (1) Add the weighed raw materials (40kg pure Bi, 35kg pure Sn, 200g pure Zn, 150g pure Al, 100g pure Cu, 150g pure P, 24.4kg pure In, 100kg in total) into the smelting furnace (200kg) according to the formula, Add 100g of ZnCl 2 Melt the covering agent, heat it to 650°C, and keep it warm for 30 minutes.

[0040] (2) After stirring the obtained melt for 30 minutes, remove the surface covering agent, and pour it into a mold to make a low-temperature solder ingot.

[0041] (3) On an extruder, extrude the ingot obtained in step (2) into strips, filaments or atomize to prepare spherical alloy solder powder.

[0042] The temperature and time curve of the low-temperature lead-free solder in this embodiment is shown in figure 1 (DSC is Indicated Differential Scanning Calorimeter).

Embodiment 2

[0043] Embodiment 2 low temperature lead-free solder

[0044] Formula: Bi 40%, Sn 35% by mass percentage, and the rest is In.

[0045] Preparation method: with reference to Example 1.

Embodiment 3

[0046] Embodiment 3 low temperature lead-free solder

[0047] Formula: Bi 40%, Sn 34%, Zn 0.5%, Al 0.1%, Ag 0.1%, Cu0.1% by mass percentage, and the rest is In.

[0048] Preparation method: with reference to Example 1.

[0049] The temperature and time curve of the low-temperature lead-free solder in this embodiment is shown in figure 2 .

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Abstract

The invention discloses low-temperature lead-free solder and used for welding electrical contact materials. The low-temperature lead-free solder comprises, by mass percent, 30%-65% of Bi, 15%-50% of Sn and 15%-45% of In. To improve the mechanical performance of the alloy solder and improve the oxidation resistance, the wettability and the like, one or more of microelements including Ag, Zn, Al, Cu, Ga, P and the like is appropriately added. The melting point of the low-temperature solder is controlled within the range of 75 DEG C-100 DEG C, is used for removing damage of welding temperature toa welded object in the welding process and has the advantages that the melting temperature is low, during welding, the binding rate with copper foil is high, the loss tangent value of a capacitor issmall, the partial discharging performance and the overvoltage and large current resistance of the capacitor are improved, the cost is relatively low, no lead exists and the low-temperature lead-freesolder is more environmentally friendly. The low-temperature lead-free solder is especially suitable for welding heat sensitive elements, semiconductor elements with semiconductor manner refrigeratingelements and the like.

Description

technical field [0001] The invention relates to a low-temperature soldering material, in particular to the field of low-temperature soldering, which is applied to the field of welding small-sized LED lamp beads and copper wires, the field of soldering materials for the electronic industry, and the field of electrical contact materials. Background technique [0002] Whether it is welding LED lamp beads and wires on fabrics, or electronic components and electronic materials assembled into electronic equipment, if they are exposed to high temperatures without heat resistance, their functions and structures will deteriorate and be damaged. destroy. Such electronic parts and electronic materials must be brazed at low temperature, and for this reason, solder with a low melting point, that is, low-temperature solder, must be used. Low-temperature solder is not clearly defined, but generally refers to a solder whose solidus temperature and liquidus temperature (melting point) are l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/26B23K35/40
Inventor 郭文波耿家维张俊蔡昌礼邓中山
Owner YUNNAN KEWEI LIQUID METAL VALLEY R & D CO LTD
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