Unlock instant, AI-driven research and patent intelligence for your innovation.

Microwave multilayer board and laminating device and laminating method thereof

A technology of lamination device and multi-layer board, applied in the direction of lamination device, lamination, lamination auxiliary operation, etc., can solve problems such as increase in failure rate, difficulty of vacuum pressing machine to meet production requirements, and uneven pressing

Inactive Publication Date: 2021-08-10
南京欣达飞科技股份有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There is an existing microwave multilayer board whose material is relatively soft. When in use, the length of this kind of microwave multilayer board is required to be longer (generally greater than 550mm). However, if the microwave multilayer board is too long, it will cause layer deviation, Various production problems such as uneven pressing lead to an increase in the failure rate
Therefore, when a relatively long microwave multi-layer board is required in some occasions, it is difficult for the vacuum press to meet the production demand.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microwave multilayer board and laminating device and laminating method thereof
  • Microwave multilayer board and laminating device and laminating method thereof
  • Microwave multilayer board and laminating device and laminating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] refer to figure 1 , is a microwave multilayer board disclosed in the embodiment of the present application. The microwave multilayer board includes a main board 1 in the middle part and auxiliary boards 2 integrally connected to both ends of the main board 1 in the length direction, wherein the auxiliary board 2 includes a 1 The connection plate 2a with the same width and the extension plate 2b arranged on the connection plate 2a, the length of the main body plate 1 is set to be greater than or equal to 550mm, and the extension plate 2b is provided with a positioning hole 21 for positioning in the subsequent lamination process.

[0060] refer to figure 2 , the microwave multilayer board is sequentially from bottom to top, the first copper clad layer 11, the first substrate 12, the second copper clad layer 13, the adhesive film layer 14, the second substrate 15 and the third copper clad layer 16, Wherein the first copper clad layer 11 is crimped on the bottom surface o...

Embodiment 2

[0062] refer to image 3 , the present invention also discloses a lamination device for processing the above-mentioned microwave multilayer board, the lamination device includes a vacuum lamination box 3, and the bottom end of the vacuum lamination box 3 is provided with a leg 10 for support. A support platform 19 is provided on the bottom surface of the vacuum press box 3, and the length direction of the support platform 19 is parallel to the length direction of the vacuum press box 3. A cavity is provided inside the support platform 19, and a lifting mechanism 5 is provided in the cavity. In the present embodiment, the elevating mechanism 5 is set as a hydraulic machine, and a support plate 4 for placing a microwave multilayer board is provided on the upper surface of the support table 19, and the length direction of the support plate 4 is parallel to the length direction of the vacuum press box 3 , the lifting mechanism 5 can drive the support plate 4 to lift in the vertica...

Embodiment 3

[0068] refer to Image 6 , which is a lamination method based on the above-mentioned microwave multilayer board lamination device disclosed in this embodiment, comprising the following steps:

[0069] Step 1. Place the first substrate 12 horizontally on the support plate 4, lay the first copper clad layer 11 horizontally on the upper surface of the first substrate 12, so that the positioning hole 21 and the positioning shaft 41 are socketed;

[0070] Step2. Adjust the lifting structure, start the corresponding moving mechanism, respectively drive the initial temperature hot pressing roller 71, the medium temperature hot pressing roller 72 and the high temperature hot pressing roller 73 to carry out the first pressing process, and the speed of the moving mechanism is controlled at 3mm / below s;

[0071] Step3, cooling, turning over, so that the first substrate 12 is located above the first copper clad layer 11, and then laying the second copper clad layer 13, the second substr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
lengthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a microwave multilayer board which can meet the use requirements of long use occasions. The invention further comprises a laminating device and a laminating method for processing the microwave multilayer board. The laminating device comprises a vacuum laminating box; a bearing plate which arranged on the bottom surface of the vacuum laminating box, wherein a lifting mechanism for driving the bearing plate to vertically lift is arranged on the bottom surface of the bearing plate; moving frames which are arranged in the vacuum pressing box and move in the length direction of the vacuum box, wherein there are three moving frames; hot pressing rollers which are rotationally arranged on the moving frames, wherein the hot pressing rollers correspond to the moving frames one to one, the hot pressing rollers comprise the initial-temperature hot pressing roller, the medium-temperature hot pressing roller and the high-temperature hot pressing roller, and the microwave multilayer board is subjected to repeated and accurate pressing multiple times; a limiting plate for limiting and a deviation rectifying mechanism are also arranged on the bearing plate, and the ultra-long microwave multilayer board can be well processed with high quality.

Description

technical field [0001] The application relates to the technical field of printed circuit board production, in particular to a microwave multilayer board, a lamination device and a lamination method thereof. Background technique [0002] Printed circuit board, also known as printed circuit board, is an important electronic component and a support for electronic components. According to the number of layers, printed circuit boards can be divided into single-layer boards, double-sided boards and multi-layer boards. According to their characteristics, they can also be divided into high TG printed boards, impedance characteristic printed boards, high-frequency microwave printed boards, and HDI printed boards. , Buried blind hole printed board. Microwave multilayer board is a kind of high-quality microwave printed board. [0003] In the production and processing of microwave multilayer boards, one of the more critical steps is to laminate the multilayer circuit boards together. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B32B15/092B32B27/38B32B7/12B32B15/04B32B27/06B32B37/06B32B37/10B32B38/18
CPCB32B15/20B32B15/092B32B27/38B32B7/12B32B15/04B32B27/06B32B37/06B32B37/10B32B38/1858
Inventor 严凯邢雨浩
Owner 南京欣达飞科技股份有限公司