Electronic device
A technology for electronic devices and conductive bumps, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of easy crushing, high cost, and high power consumption
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[0059] The implementation manners of the present disclosure are described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. The present disclosure can also be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification for different viewpoints and applications without departing from the spirit of the present invention.
[0060] Furthermore, the ordinal numbers used in the specification and claims, such as "first", "second", "third", etc., are only used to modify the requested component, and do not imply and represent the requested component. There is no preceding ordinal number, nor does it represent the order of a requested component with another requested component, or the order of the manufacturing method. The use of multiple ordinal ...
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Abstract
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