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Mounting tooling, mounting device and mounting method based on automatic mounting equipment

A technology of automatic placement and placement device, which is applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of poor packaging effect and low efficiency of chips and substrates, and achieves improved placement efficiency and flatness. , The effect of eliminating the placement error

Active Publication Date: 2022-06-28
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a chip mount tooling, a chip mount device and a chip mount method based on automatic chip mount equipment to solve the problem of poor packaging effect and low efficiency of chips and substrates in the prior art

Method used

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  • Mounting tooling, mounting device and mounting method based on automatic mounting equipment
  • Mounting tooling, mounting device and mounting method based on automatic mounting equipment
  • Mounting tooling, mounting device and mounting method based on automatic mounting equipment

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Embodiment Construction

[0035] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be more thoroughly understood, and will fully convey the scope of the present invention to those skilled in the art.

[0036] The embodiment of the first aspect of the present invention provides a patch tooling based on automatic patch equipment, such as figure 1 shown, including:

[0037] The first part 10 is adapted to be fixed to the upper surface of the equipment platform 40 of the automatic placement equipment. like Figure 4 As shown, the first part 10 has a first through hole 150 communicating with the vacuum hole suction head of the eq...

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Abstract

The invention discloses a mounting tool, a mounting device and a mounting method based on automatic mounting equipment. The placement tool based on the automatic placement equipment includes: a first part, which is suitable for being fixed to the upper surface of the equipment platform of the automatic placement equipment, and the first part has a first through hole communicating with the suction head of the vacuum hole of the equipment platform hole; the second part, its upper surface is suitable for the adsorption of the suction nozzle of the automatic placement equipment, and the lower surface of the second part is connected to the upper surface of the first part by using an adhesive to ensure the second part The upper surface is parallel to the lower surface of the suction nozzle, the second part includes a second through hole, and the first through hole is located in the second through hole. The invention can eliminate the mounting error of the equipment platform, improve the flatness of mounting, and greatly improve the mounting efficiency.

Description

technical field [0001] The present invention relates to the field of chips, in particular to a patch tool, a patch device and a patch method based on an automatic patch device. Background technique [0002] Infrared detectors can detect light in the infrared band. Among them, cooled detectors are widely used due to their high imaging resolution, high concealment, strong anti-interference ability, and long detection distance. The infrared detector chip is the eye of the infrared detector, and its flatness after packaging affects the imaging quality of the infrared detector, and is very important for the detection ability of the infrared detector. [0003] The chip of the infrared detector is generally bonded and packaged with the substrate. There are positioning marks on the chip and the substrate, which are used for positioning in the X and Y directions when the chip is bonded to the substrate. The flatness of the chip bonding is mainly determined by the thickness of the adh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67121H01L21/6838
Inventor 田亚付志凯王冠
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP