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Preparation method of sensor assembly

A sensor component and sensor technology, applied in the input/output process of instruments, data processing, calculations, etc., can solve problems such as sensor integration, and achieve the effect of reducing thickness, reducing production costs, and improving detection performance

Active Publication Date: 2021-09-24
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present application provides a sensor assembly to solve the problem of how to conveniently integrate many sensors into the display module in the existing touch screen

Method used

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  • Preparation method of sensor assembly
  • Preparation method of sensor assembly
  • Preparation method of sensor assembly

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0043] Reference attached figure 1 , the preparation method of the sensor assembly provided by the embodiment of the present application, which includes the following steps:

[0044] 101. Provide a first substrate 1;

[0045] 102. Prepare a first sensor on the first substrate 1;

[0046] 103. Prepare the second sensor 6;

[0047] Wherein, the preparation of the first sensor includes providing a first metal wiring 11 and a second metal wiring 2;

[0048] After preparing the second sensor 6 , it also includes connecting the second sensor 6 and the second metal wiring 2 .

[0049] Specifically, in order to solve the problem of how to conveniently integrate many sensors in the existing electronic equipment, in the method for preparing the sensor component provided in this embodiment, the first metal wiring is simultaneously prepared during the process of preparing the first sensor 11 and the second metal wiring 2, wherein the second metal wiring 2 is the wiring of the second s...

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Abstract

The invention discloses a preparation method of a sensor assembly. The preparation method comprises the following steps: providing a first base material; preparing a first sensor on the first substrate; preparing a second sensor; wherein the step of preparing the first sensor comprises the step of providing a first metal wire and a second metal wire; and connecting the second sensor with the second metal wire after the preparation of the second sensor. The routing of the second sensor is prepared while the first sensor is prepared, and the second sensor can be directly connected with the second metal routing, so that the detection performance of the second sensor is improved, and meanwhile, the problem that the routing of the second sensor needs to be additionally printed with a circuit board is solved; therefore, the manufacturing cost of the touch display module can be effectively reduced, and the thickness of the whole equipment is effectively reduced.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a method for preparing a sensor component. Background technique [0002] With the gradual increase of functions of electronic equipment, multiple sensors need to be installed in the electronic equipment to complete the execution of corresponding functions; however, how to conveniently integrate many sensors into the display module has become an urgent problem to be solved. Contents of the invention [0003] The embodiment of the present application provides a sensor assembly to solve the problem of how to conveniently integrate many sensors into a display module in an existing touch screen. [0004] In order to solve the above technical problems, the embodiments of the present application provide the following technical solutions: [0005] The first aspect of the present application provides a method for preparing a sensor assembly, which includes the fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041G06F3/044
CPCG06F3/0412G06F3/04164G06F3/0445G06F2203/04103Y02P70/50
Inventor 赵振元高营
Owner LENOVO (BEIJING) LTD