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Span-adjustable centering clamping device for wafer processing equipment

A technology of processing equipment and clamping device, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as high production cost and processing time, damage to the first set of clamping jaw mechanism, and irregular surface of silicon rods, etc.

Pending Publication Date: 2021-09-24
DALIAN LIANCHENG NUMERICAL CONTROL MACHINE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the clamping and feeding process of silicon rods, since the roundness and diameter of each cross-sectional circle of silicon rods along its axis are irregular, and the lengths and diameters of silicon rods of different specifications are different, Need to use different grippers to grab it, which is quite high in production cost and processing time
[0003] At the same time, because the surface of the silicon rod is irregular, it is easy to cause the axial direction of the silicon rod to be clamped and not parallel to the axis of the processing machine tool, which is not conducive to processing.
[0004] The existing silicon rod clamping and feeding mechanism cannot directly determine the specifications of the silicon rod
[0005] In the existing silicon rod clamping and feeding mechanism, after feeding, another set of jaws clamps the axial end face of the silicon rod. At this time, the former set of jaws also performs radial clamping. When moving in the axial direction, it is easy to cause damage to the first set of jaw mechanisms
[0006] The existing silicon rod clamping and feeding mechanism, the structure carrying the silicon rod is rigid load, after the silicon rod is clamped, the silicon rod will have a small displacement up and down, because of the rigid load, it will cause the surface of the silicon rod destroy

Method used

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  • Span-adjustable centering clamping device for wafer processing equipment
  • Span-adjustable centering clamping device for wafer processing equipment
  • Span-adjustable centering clamping device for wafer processing equipment

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Embodiment Construction

[0066] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0067] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is only some embodiments of the present invention, but not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordina...

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Abstract

The invention provides a span-adjustable centering clamping device for wafer processing equipment. The span-adjustable centering clamping device comprises two sliding plate guide rails, a silicon rod bearing device, two clamping jaw systems and a clamping jaw system driving mechanism; each clamping jaw system comprises a sliding plate, a clamping jaw guide rail, two clamping jaws and a clamping jaw driving mechanism, and is used for driving the two clamping jaws to move towards each other or away from each other in the extending direction of the clamping jaw guide rail. The extending direction of the sliding plate guide rails is perpendicular to the extending direction of the clamping jaw guide rails, and the opposite faces of the two clamping jaws are provided with V-shaped clamping openings. According to the invention, cylindrical wafer blank bars with different diameter specifications can be fixed and clamped by keeping the same center. And the span of clamping points can be adjusted according to silicon rods with different lengths, so that the central axis of a wafer blank is horizontal.

Description

technical field [0001] The invention relates to the technical field of silicon rod clamping, in particular to a centering clamping device with adjustable span for wafer processing equipment. Background technique [0002] During the grinding process of silicon rods, it is necessary to clamp and load the silicon rods with a set of jaws. The rod axis moves, this group of jaws clamps the axial end face of the silicon rod, and then the grinding head grinds the silicon rod. During the clamping and feeding process of silicon rods, since the roundness and diameter of each cross-sectional circle of silicon rods along its axis are irregular, and the lengths and diameters of silicon rods of different specifications are different, It needs to be grasped by different jaws, which increases the production cost and processing time. [0003] At the same time, because the surface of the silicon rod is irregular, it is easy to cause the axial direction of the silicon rod to be clamped and no...

Claims

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Application Information

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IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/6875H01L21/68728H01L21/67259
Inventor 朱凯周江辉唐学千金明来金敬武徐杰王永哲
Owner DALIAN LIANCHENG NUMERICAL CONTROL MACHINE