Die bonding system with heated automatic collet changer
A heater and heating technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of increasing machine cycle time and time consumption, and achieve the effect of minimizing the probability of cracking and dislocation
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[0036] For the purposes of this disclosure, the X, Y, and Z axes should be understood to refer to three orthogonal linear axes, while "T", which may also be referred to as Theta or Θ, refers to the rotational axis.
[0037] Furthermore, as used herein, the term "cam type" when used with reference to a wafer handler 100 should be understood to refer to a wafer handler 100 capable of manipulating the roll, pitch, and yaw of a wafer 300 to achieve planarization. . In non-cam wafer handler 100 embodiments, Z-axis motion of wafer handler 100 is still present. In even other embodiments, wafer handler 100 may be of the cam type, but in an embodiment limited to Z-axis motion by synchronizing all cams 106 .
[0038] Figures 1 to 9An adjustable-cam or cam-type wafer handler 100 is shown that maximizes efficiency by requiring only one alignment procedure to be performed per wafer 300 while ensuring the flatness of the wafer 300 to the die bond head 1200 provided that a single tip 1100...
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