Apparatus, system, and method of providing underfill on a circuit board
An underfill, printed circuit board technology, applied in the direction of assembling printed circuits, circuits, and printed circuits with electrical components, can solve problems such as increasing difficulty
Active Publication Date: 2021-10-22
JABIL INC
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- Description
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- Application Information
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Problems solved by technology
[0006] However, the underfill process has increased difficulty for larger boards, at least because it is difficult to access components on large boards to underfill those components, and also because underfill is capillary in most processes As a result, the underfill flows under the component by capillary action in the presence of heat
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[0033] The drawings and descriptions provided herein may have been simplified to illustrate aspects that are relevant to a clear understanding of the devices, systems and methods described herein, while, for the sake of clarity, other aspects that may be found in typically similar devices, systems and methods have been eliminated . One of ordinary skill in the art may recognize that other elements and / or operations may be desirable and / or necessary to implement the devices, systems, and methods described herein. However, because such elements and operations are well known in the art, and because they do not facilitate a better understanding of the present disclosure, a discussion of such elements and operations may not be provided here. However, the present disclosure is considered to inherently include all such elements, changes and modifications to the described aspects that would be known to those of ordinary skill in the art.
[0034] The terminology used herein is for th...
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An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.
Description
[0001] Cross References to Related Applications [0002] This application claims the benefit of priority to U.S. Provisional Application 62 / 788,501, entitled: "Apparatus, System, and Method for Providing Underfill on a Circuit Board," filed January 4, 2019, the entire contents of which are incorporated by reference This document, as if set forth in its entirety. [0003] background technical field [0004] The present invention relates to circuit board manufacturing, and more particularly to an apparatus, system and method for providing underfill on a circuit board. Background technique [0005] During a typical printed circuit board production process, many steps must be performed to complete the target board. Briefly, these steps typically include placing solder on the board, adjacent to and along existing printed circuit traces; picking up circuit components and placing them onto the solder, wherein, These components may include, by way of example, resistors, capacitor...
Claims
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IPC IPC(8): H05K13/04H05K13/00H05K3/34
CPCH05K2201/10977H05K3/305H05K3/3436H01L21/563H01L24/743H01L2224/73204H01L2224/16225H01L2224/32225H01L2224/92125H01L2224/13101H01L2224/81801H01L2224/81815H01L24/13H01L24/32H01L24/73H01L24/81H01L24/92H01L2224/8385H01L24/83H01L24/75H01L2224/75101H01L2224/75251H01L2224/75252H01P1/2082H01P1/2088H05K3/284H05K2203/1316H05K2203/1572H05K2203/0126H05K2201/0367H01L2924/00012H01L2924/014H01L2924/00014B05B13/0431B05B13/0447F24H3/022H05B1/023H05B6/10H05B6/44H05K13/0469
Inventor M·塔德曼R·洛夫廷
Owner JABIL INC