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Loading platform and its processing method and hot pressing device

A technology of hot pressing device and processing method, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., and can solve problems such as product quality degradation

Active Publication Date: 2022-07-12
东莞联鹏智能装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Based on this, it is necessary to provide a loading platform and its processing method and a hot pressing device for the problem of product quality degradation caused by the current loading platform hot pressing products

Method used

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  • Loading platform and its processing method and hot pressing device
  • Loading platform and its processing method and hot pressing device
  • Loading platform and its processing method and hot pressing device

Examples

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Embodiment Construction

[0037] In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0038] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Back, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Countercl...

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Abstract

The invention relates to a material-carrying platform, a processing method and a hot-pressing device thereof. The material-carrying platform comprises a material-bearing table and a heat insulation plate, and the heat-insulating plate is arranged on one side of the material-bearing table for supporting products. , and is used to insulate heat transfer to the loading table, wherein the thermal expansion coefficient of the thermal insulation board is less than 6*10 ‑7 / °C, the thermal conductivity of the heat shield is less than 1.6 W / mK. Through the setting of the heat insulation plate, the heat transfer from the thermal head to the loading table is reduced. The above-mentioned material-carrying platform is provided with a heat-insulating plate to reduce the heat transfer from the thermal head to the material-bearing table. The heat of the hot-pressing head is only concentrated under the hot-pressing head, and will not spread to the entire loading platform, thereby ensuring the quality of the products after hot-pressing.

Description

technical field [0001] The invention relates to the technical field of semiconductor device processing, in particular to a material carrier platform, a processing method and a hot pressing device. Background technique [0002] Hot pressing machine (hot pressing device), also known as bonding machine, can be divided into solder, ACF (Anisotropic Conductive Film, anisotropic conductive tape), ACP (Anisotropic conductive paste / adhesive, anisotropic conductive tape) according to different hot pressing media glue), TBF (Thermal Bonding Film, hot melt adhesive film) bonding machine. Suitable for FPC (Flexible Printed Circuit, flexible circuit board), HSC (Heat Seal Connecto, zebra paper), TAB (Tape Automated Bonding, tape automatic welding), LCD (Liquid Crystal Display, liquid crystal display) and PCB (Printed Circuit Board) , printed circuit board) connections. [0003] The heat press includes a loading platform for placing glass or PCB and FPC components. The main function of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673H01L21/683H01L21/687B23P15/00
CPCH01L21/67336H01L21/6838H01L21/687B23P15/00
Inventor 李立辉范杰李良廖玉红刘思文
Owner 东莞联鹏智能装备有限公司
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