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Vibration module and manufacturing method thereof

A manufacturing method and vibration module technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, instruments, electrical digital data processing, etc., can solve problems such as complex structural design

Pending Publication Date: 2021-11-19
DARWIN PRECISIONS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for vibration feedback applications using piezoelectric materials, it is necessary to provide a spring structure as a vibration buffer and mass load, and a corresponding elastic / damping structure needs to be designed, and the structural design is more complicated
In addition, it is impossible to provide vibration and sensor feedback for precise positions

Method used

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  • Vibration module and manufacturing method thereof
  • Vibration module and manufacturing method thereof
  • Vibration module and manufacturing method thereof

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Embodiment Construction

[0035] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0036] The implementation of the connection assembly disclosed in the present invention will be described below through specific specific embodiments and accompanying drawings. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. However, the content disclosed below is not intended to limit the protection scope of the present invention. Those skilled in the art can implement the present invention in other different embodiments based on different viewpoints and applications without departing from the spirit of the present invention. In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It will be understood tha...

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Abstract

A vibration module including a diaphragm, a piezoelectric device, and a substrate is provided. The diaphragm has a first surface. The piezoelectric device is arranged on the first surface. The substrate is disposed on the first surface in an in-mold injection manner, and contacts and coats the piezoelectric device.

Description

technical field [0001] The invention relates to a vibration module and a manufacturing method thereof. Background technique [0002] In various electronic devices, vibration mechanisms are often provided to generate vibrations for prompting, feedback and other purposes. It is known that the vibrating mechanism installed in the electronic device usually uses elements such as actuators, piezoelectric materials, electric fields, and ultrasonic waves to generate vibration effects, depending on design requirements and characteristics of the electronic device. [0003] Piezoelectric materials are a widely used option for designing vibration mechanisms. However, for vibration feedback applications using piezoelectric materials, it is necessary to provide a spring structure as a vibration buffer and mass load, and a corresponding elastic / damping structure needs to be designed, and the structural design is relatively complicated. In addition, it is impossible to provide vibration a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L41/053H01L41/23G06F3/041H10N30/20H10N30/88H10N30/02H10N30/06H10N30/07H10N30/87
CPCG06F3/041H10N30/88H10N30/02H10N30/883H10N30/074H10N30/704H10N30/20H10N30/06H10N30/07H10N30/87
Inventor 赖裕仁
Owner DARWIN PRECISIONS CORP