High-impact-resistant lead assembling method

Abstract

The invention discloses a high-impact-resistant lead wire assembling method. The method comprises the following steps: 1, bonding and interconnecting bonding areas in an integrated circuit by using lead wires with exposed metal by adopting a conventional thermal ultrasonic bonding process to form a conventional lead wire assembly product; 2, using needle head type atomization spraying equipment to align a spraying needle head at the upper part of the bonded lead wire to carry out movable spraying, so as to make the UV insulating glue uniformly sprayed on the surface of the bonded lead wire; and 3, curing the sprayed lead wire under a UV lamp to make the liquid insulation paste wrapping the surface of the lead wire cured, so as to form an insulation solid protection layer. According to the invention, lead assembly can be completed quickly and efficiently at low cost, subsequent maintenance and reworking of the integrated circuit can be facilitated, and high impact resistance of the integrated circuit is realized.

Description

technical field [0001] The invention relates to the technical field of microelectronic product manufacturing, in particular to a method for assembling high-impact-resistant lead wires. Background technique [0002] The wire assembly process refers to the use of the ultrasonic energy of the bonding machine to accurately and reliably interconnect the bonding areas in the hybrid integrated circuit with high-purity fine metal wires according to the product assembly drawing, so that the entire circuit can be completed. An operating procedure for a specified electrical function. The lead assembly process is a basic assembly process of microelectronic products. At present, more than 90% of the integrated circuits are packaged using the lead assembly technology. [0003] The high overload resistance of leads mainly refers to the specific indicators that they can withstand direct impact force and impact inertial force, which directly affects the application environment in which inte...

AI Technical Summary

Problems solved by technology

Among them, the plastic-encapsulated lead assembly process needs to add special plastic-encapsulated production lines, plastic-encapsulated fixtures, etc. on the basis of conventional lead assembly. The process is complicated and the cost is high; If it is qualified, it cannot be opened and reworked, and can only be scrapped; the cost of using insulated gold wire is more than 10 times that of conventional lead wires, which will lead to a substantial increase in product cost

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