Wafer cleaning device
A technology for cleaning wafers and wafers, applied in the direction of spraying devices, liquid spraying devices, cleaning methods and utensils, etc., can solve the problems of sponge consumption, cleaning utensil replacement costs, etc., and achieve the effect of cost avoidance
Pending Publication Date: 2022-01-04
DISCO CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0009] However, in the conventional cleaning method, the sponge used as the cleaning tool is consumed, so the cost of replacing the cleaning tool is high.
Method used
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Embodiment Construction
[0020] Such as figure 1 As shown, the wafer cleaning apparatus 1 of this embodiment is used to clean the outer peripheral edge 101 of the wafer 100 . The outer peripheral edge 101 is rounded because it is chamfered in an arc shape from one surface to the other surface of the wafer 100 .
[0021] In addition, the wafer 100 has been subjected to grinding processing, and the protective member previously formed on one surface of the wafer 100 has been peeled off. Therefore, dirt such as resin, which is a material of the protective member, adheres to the outer peripheral edge 101 of the wafer 100 . In the wafer cleaning apparatus 1 , by cleaning the outer peripheral edge 101 of the wafer 100 , dirt such as resin is removed.
[0022] The wafer cleaning apparatus 1 has a holding table 10 for holding a wafer 100 . The holding table 10 has a holding surface 11 smaller than the wafer 100 . The holding surface 11 is made of, for example, a porous material, and can suck and hold the w...
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The invention provides a wafer cleaning device which removes resin attached to the outer periphery of a wafer without using a cleaning tool. The wafer cleaning device is used for cleaning an outer peripheral edge of a wafer, and includes a cleaning unit that sprays high-pressure water toward the outer peripheral edge of the wafer from a position outside the outer peripheral edge of the wafer held by a holding surface of a holding table to clean the outer peripheral edge of the wafer. The cleaning unit includes: a first nozzle that sprays high-pressure water to the outer peripheral edge of the wafer in a direction parallel to the holding surface from a position outside the outer peripheral edge of the wafer; a second nozzle that sprays high-pressure water to the outer peripheral edge of the wafer in a direction facing 45 degrees downward with respect to the holding surface; and a third nozzle that sprays high-pressure water to the outer peripheral edge of the wafer in a direction that faces up by 45 degrees with respect to the holding surface.
Description
technical field [0001] The invention relates to a wafer cleaning device. Background technique [0002] In the manufacture of wafers, wafers in which waviness or warpage is formed can be obtained by slicing a semiconductor ingot. In order to remove waviness and warpage from the wafer, as disclosed in Patent Document 1, a protective member made of resin and a sheet is formed on one surface of the wafer. [0003] Then, one surface of the wafer is held by a chuck table through a protective member, and the other surface of the wafer is ground by a grinding tool to remove waviness and warpage. [0004] After grinding the other surface of the wafer, as disclosed in Patent Document 2, the protective member is peeled off, and one surface of the wafer is ground. Thus, a wafer having a predetermined thickness is manufactured. [0005] When the protective member is peeled off from the wafer, resin may remain on the outer peripheral edge (edge) of the wafer. Therefore, as disclosed i...
Claims
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IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/67051H01L21/02041H01L21/02087H01L21/67034B08B3/02F26B5/08B05B7/0416B08B3/022B08B13/00H01L21/68764
Inventor 竹田祥平石川智久酒井是贵
Owner DISCO CORP