Image processing program, image processing device and image processing method
An image processing device and image processing technology, applied in the field of image processing, can solve the problems of design data shape deviation, frequent false reports and the like
Pending Publication Date: 2022-01-28
HITACHI HIGH-TECH CORP
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Problems solved by technology
[0005] However, in the pattern transferred to the wafer, there are many deviations from the design data (differences in the roundness of the corners, etc.) to a degree that does not affect the electrical characteristics of the semiconductor device.
In the chip-to-database check, the deviation of this shape is also detected, so there is a problem of frequent false alarms
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[0039] The semiconductor inspection apparatus exemplified in the embodiments described below relates to an image processing program that suppresses frequent occurrence of false alarms and detects only defective regions using a captured image of an inspection object pattern (inspection object image) and a design data image, and uses the image Processor semiconductor inspection device. In addition to design data, simulated images of semiconductor manufacturing processes, average images of circuit patterns, images generated by handwriting, and the like are also suitable for comparison with images of inspection objects, without limitation.
[0040] In addition, as a specific example, an example of the method of estimating the luminance value of each pixel on the inspection target image from the design data image using machine learning as a statistic defining its probability distribution, and detecting Check the object image for defective areas. In this embodiment, the statistic r...
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The purpose of the present invention is to provide a computer program for achieving die-to-database inspection at high speed and with few false reports, and a semiconductor inspection device using the same. To achieve this purpose, the present invention proposes: a computer program comprising an encoder layer S302 that is configured to determine the features of a design data image, and a decoder layer S303 that is configured to generate, on the basis of a variation in an image (inspection target image) obtained by photographing an inspection target pattern, a statistic pertaining to the brightness values of pixels from feature values output by the encoder layer, wherein die-to-database inspection with few false reports can be achieved by comparing the inspection target image and the statistic obtained from the decoder layer and pertaining to the brightness values, and thereby detecting a defect region in the image; and a semiconductor inspection device using the same.
Description
technical field [0001] The present invention relates to image processing technology for processing image data. In particular, it relates to an image processing technique that can be used in inspections using image data. An example of inspection objects includes semiconductor circuits. Background technique [0002] Conventionally, as an inspection using image data, inspection is performed by comparing design data of a sample to be inspected with imaged data obtained by imaging the object to be inspected. An example of an article includes an article for inspecting a semiconductor circuit. [0003] With the miniaturization of semiconductor circuit patterns, the resolution of exposure equipment reaches its limit, making it difficult to form circuit patterns as designed on wafers. The wiring width of the circuit pattern formed on the semiconductor wafer deviates from the design value, or the front end of the pattern tends to recede, or defects such as deformation of the shape ...
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IPC IPC(8): G06T7/00G06N3/04G06N3/08
CPCG06T7/001G06T2207/10061G06T2207/20081G06T2207/20084G06T2207/30148G06T7/00G06N20/00G06T9/005
Inventor 大内将记筱田伸一丰田康隆弓场龙新藤博之
Owner HITACHI HIGH-TECH CORP