Preparation method of medium-temperature-curing zero-adhesive-absorption epoxy resin matrix material

A technology for glue epoxy resin and epoxy resin, which is applied in the field of preparation of medium temperature curing zero suction glue epoxy resin matrix material, can solve the problems of uneven resin content and large quality fluctuation, and achieves uniform resin content, excellent performance, The effect of high engineering application value

Pending Publication Date: 2022-02-01
中威北化科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of non-uniform resin content and large quality fluctuations in composite material parts existing in the existing autoclave curing process pressure point control and glue absorption process, and to provide a medium-temperature curing zero-absorption epoxy resin matrix Material preparation method

Method used

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  • Preparation method of medium-temperature-curing zero-adhesive-absorption epoxy resin matrix material

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specific Embodiment approach 1

[0016] DETAILED DESCRIPTION OF THE INVENTION First: The preparation method of temperature curing zero suction epoxy resin matrix material in this embodiment is achieved by the following steps:

[0017] First, the epoxy resin is placed in a dried container, heated at 80-100 ° C and stirred for 1-3 h, resulting in a melted epoxy resin;

[0018] Second, the epoxy resin, epoxy resin modifier, and catalyst are placed in a dried container, heated at 100-200 ° C and stirring for 1-3 hours, resulting in a rheological control component;

[0019] Third, the epoxy resin is placed in a dry container, heated at 40-60 ° C and stirred at 0.5 to 2 h, resulting in a low viscosity epoxy resin, then adding a curing agent or a mixture of a curing agent and an accelerator and stirring 0.5-1 h. , Grind 3-5 times on the three-roller grinder to obtain a curing component;

[0020] 4. The above-mentioned molten epoxy resin, the rheological control component, and the curing component are mixed in a vacuum s...

specific Embodiment approach 2

[0021] DETAILED DESCRIPTION OF THE INVENTION Different: The present embodiment differs from the specific embodiment, and the epoxy resin described in step one, two and three is bisphenol A epoxy resin, bisphenol F-type epoxy resin, bisphenol S. Epoxy resin, phenolic epoxy resin, epoxy epoxy resin, three functional epoxy resin, tetrafunctional epoxy resin, one or several compositions in an epoxy resin in an oxygen resin. Other steps and parameters are identical to those of the specific embodiments.

[0022] In the present embodiment, the epoxy resin is a composition, and each component is mixed in any than.

specific Embodiment approach 3

[0023] BEST MODE FOR CARRYING OUT THE INVENTION 3: The present embodiment is different from that of the specific embodiment, and the agitation rate in steps 1, two and three is from 500 to 1000 r / min. Other steps and parameters are identical to those of the specific embodiments.

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Abstract

The invention discloses a preparation method of a medium-temperature-curing zero-adhesive-absorption epoxy resin matrix material, belonging to the technical field of new materials. The invention aims to solve the problems of non-uniform resin content and large quality fluctuation in a composite material part in a pressurization point control and adhesive absorption process of a conventional autoclave curing process. The method comprises the following steps: 1, preparing molten epoxy resin; 2, preparing a rheological control component; 3, preparing a curing component; and 4, uniformly mixing the molten epoxy resin, the rheological control component and the curing component in a vacuum stirring kettle, conducting discharging, and then carrying out cooling and sealing. The medium-temperature-curing zero-adhesive-absorption epoxy resin matrix material prepared by the invention realizes rheological control on an epoxy resin matrix, so a resin system has viscosity matched with forming pressure in the whole forming process, the process control process of tank feeding pressurization, medium-temperature curing and zero adhesive absorption can be realized in an autoclave forming process, resin content is uniform, stable quality is obtained, and the CIA value of a product is improved.

Description

Technical field [0001] The present invention belongs to the technical field of new materials, and more particularly to the preparation method of medium temperature curing zero suction epoxy substrate material. Background technique [0002] At present, there are many epoxy resin systems, and the traditional epoxy resin system material is crisp, and the long-term use temperature is generally not more than 150 ° C. The process is limited, and the thermoset resin of the resin group composite is. host. The thermosetting epoxy resin system itself has a certain defective property, according to the fracture theory, the pure thermosetting epoxy resin is existing in internal defects such as broken cracks and silver, and these defects will be rapidly expanded when they are impacted by external force. It can be converted to the surface of the new crack, which will expand rapidly until it is more than a certain strength. Therefore, the epoxy resin is used as a prepreg matrix application, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02
CPCC08L63/00
Inventor 刘钟铃卢燕王凡文黄昌伟
Owner 中威北化科技有限公司
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