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Solder alloy

A solder alloy, alloy composition technology, applied in welding/cutting medium/material, welding medium, metal processing, etc., can solve problems such as joint fracture

Pending Publication Date: 2022-02-18
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the conventional Sn-3Ag-0.5Cu solder alloy is used, there is a possibility of cracking at the junction, and a solder alloy that suppresses fracture of the junction even in an environment with a severe temperature difference is being studied.

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment

[0068] Next, specific examples according to this embodiment will be described. The present inventors measured creep resistance, workability, and melting point of solder alloys having alloy compositions shown in Table 1 and Table 2 by the following methods.

[0069] [Table 1]

[0070]

[0071] [Table 2]

[0072]

[0073] (creep resistance)

[0074] For the solder alloys having the alloy compositions shown in Table 1 and Table 2, the minimum creep speed, which is an index of creep resistance, was calculated from the results of the tensile test. The calculation method is as follows. That is, at room temperature, in 4 modes ((a) 60 [mm / min], (b) 6 [mm / min], (c) 0.6 [mm / min], (d) 0.06 [mm / min] ) at a strain rate of ) and a tensile test (measuring device: universal testing machine 5966 (manufacturer: Instron)) was performed, and the minimum creep rate was calculated from the result. In addition, regarding the test piece size, the gauge length was 30 mm, and the diameter o...

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PUM

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Abstract

The invention relates to solder alloy which has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.

Description

technical field [0001] The present invention relates to solder alloys, and more particularly to lead-free solder alloys. Background technique [0002] In recent years, automobiles have been developing towards automotive electronics, and are transitioning from gasoline vehicles to hybrid vehicles and electric vehicles. Hybrid vehicles and electric vehicles are equipped with in-vehicle electronic circuits in which electronic components are soldered to printed circuit boards. Vehicle-mounted electronic circuits have traditionally been placed in the cabin where the vibration environment is relatively mild. However, due to the expansion of applications, the vehicle-mounted electronic circuits are directly mounted in the engine compartment, the oil compartment of the transmission, and further directly mounted on mechanical devices. [0003] In this way, in-vehicle electronic circuits are mounted in locations that receive various external loads such as temperature differences, sho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/02
CPCB23K35/22B23K35/262B23K35/26B23K35/24B23K35/0244B23K35/025B23K35/02C22C13/02B23K2101/36B23K2103/08
Inventor 饭岛裕贵吉川俊策斋藤岳
Owner SENJU METAL IND CO LTD