Method for detection of molecular pollutants in air and method for forming copper interconnection structures
A detection method and technology for pollutants, which are applied in the fields of analysis of materials, measurement devices, and material analysis using radiation diffraction, can solve the problems of difficulty in ensuring the timeliness of detection, inflexible detection point settings, and expensive detection machines. Intuitive and fast detection, convenient and timely detection effect
Active Publication Date: 2022-04-22
GUANGZHOU CANSEMI TECH INC
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like Figure 1b As shown, when the substrate 10' is covered and filled with electroplated copper 30', a void 31' (Void) will be formed at the corrosion defect 21', thereby affecting the manufacturing process yield or the reliability of the formed device
from above Figure 1a and Figure 1b It can be seen that the defects (such as voids) caused by AMC may be difficult to detect from defect inspection or WAT of subsequent product wafers, even if the defect can be detected in the sorting yield (Sort yield) test , but it may take one month from the copper process to the Sort yield, making it difficult to guarantee the timeliness of detection
On the other hand, since AMC includes multiple components such as molecular acid (MA, Molecular Acid), molecular base (MB), condensable organic pollutants (MC) and dopant (MD), it will lead to direct detection of AMC The detection equipment for the concentration of each component is very expensive, which makes the cost of AMC detection relatively high, and the setting of detection points is not flexible
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[0025] In order to make the purpose, advantages and features of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in very simplified form and not drawn to scale, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention. In addition, the structures shown in the drawings are often a part of the actual structures. In particular, each drawing needs to display different emphases, and sometimes uses different scales.
[0026] As used in the present invention, the singular forms "a", "an" and "the" include plural objects, the term "or" is usually used in the sense of including "and / or", and the term "several" Usually, the term "at least one" is used in the meaning of "at least one", and the term "at least two" is usually used in the meaning of "two or more". In ...
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Abstract
The invention provides a method for detecting molecular pollutants in the air of a clean room, comprising: providing at least one detection substrate, a sensitive layer is formed on the surface of the detection substrate, and the sensitive layer includes a metal copper layer; Set the time, and obtain the defect data of the detected substrate, the defect data is the defect data formed in the sensitive layer by molecular pollutants in the air of the clean room; and, compare whether the defect data of the detected substrate is less than the preset defect value of the clean room, If so, the concentration of molecular pollutants in the air of the clean room is normal. In the present invention, molecular pollutants in the air are used to form defects with the sensitive layer, and then the defect data of the detection substrate is obtained, and the defect data is compared with the preset defect value. If the defect data of the detection substrate is less than the preset defect value, it is judged The concentration of molecular pollutants in the air of the clean room is normal, thus realizing the convenient and timely detection of molecular pollutants in the air of the clean room.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for detecting molecular pollutants in the air and a method for forming a copper interconnection structure. Background technique [0002] The clean room (Clean Room) of semiconductor device manufacturing (Fabrication, FAB) has strict control requirements on molecular pollutants (Airborne Molecular Contamination) in the air. Among them, molecular pollutants in the air not only affect the yield of the manufacturing process, but may also pose risks to the health of personnel. [0003] Such as Figure 1a As shown, an opening 11' (Via) for interconnection is formed on the substrate 10' before the copper electroplating (ECP) process, and a thin layer of seed crystal copper layer 20' (Cu seed) is formed in the opening 11', It is used to conduct electricity as a cathode in the copper electroplating process to fill the electroplated copper. If the molecular pollutants in ...
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IPC IPC(8): G01N23/00G01N23/20G01N23/2273C25D21/00C25D5/34
CPCG01N23/00G01N23/20G01N23/2273C25D21/00C25D5/34
Inventor 张志敏陈献龙
Owner GUANGZHOU CANSEMI TECH INC