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Display panel, production method of display panel and display device

A display panel and display area technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems that affect the display effect of the display panel and display device, poor binding of the driver chip and the display panel, etc.

Pending Publication Date: 2022-02-25
HEFEI VISIONOX TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the above-mentioned display panel, it is easy to have poor binding between the driver chip and the display panel, which affects the display effect of the display panel and the display device.

Method used

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  • Display panel, production method of display panel and display device
  • Display panel, production method of display panel and display device
  • Display panel, production method of display panel and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0082] In the related art, the display panel has an organic layer. When the display panel is subjected to external impact or bending, the organic layer can relieve the stress on the display panel and protect each functional film layer in the display panel.

[0083] Wherein, the display panel may include a binding area, and the binding area may be used for binding a driving circuit (Integrated Circuit, IC) chip. During the bonding process, the IC chip needs to be pressed and bonded to the display panel in the bonding area, so that the conductive structure on the IC chip and the conductive part located in the bonding area are pressed and electrically connected.

[0084] However, the IC chip is relatively hard. When the IC chip is bonded to the display panel in the bonding area, the organic layer under the conductive part is deformed by force, and the organic layer will be squeezed between the adjacent conductive parts, which is easy to cause The display panel in the bonding area...

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PUM

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Abstract

The invention provides a display panel, a production method of the display panel and a display device. The display panel is used for being in binding connection with a driving chip, the display panel comprises a binding area, the display panel comprises a substrate, and an organic layer and a plurality of conductive parts are stacked on the substrate located in the binding area. The plurality of conductive parts are arranged on one side, far away from the substrate, of the organic layer at intervals; an avoiding opening is formed in the organic layer, and the orthographic projection of each conductive part on the organic layer coincides with at least a part of the avoiding opening; and the organic layer in the avoiding opening is removed so that the organic layer below the conductive part is reduced, and the deformation degree of the organic layer in the binding process is reduced. Therefore, according to the display panel, the production method of the display panel and the display device provided by the embodiment of the invention, the binding effect of the display panel and the driving chip can be improved so that the display effects of the display panel and the display device are ensured.

Description

technical field [0001] The present application relates to the technical field of display devices, in particular to a display panel, a method for preparing the display panel, and a display device. Background technique [0002] Organic Light-Emitting Diode (OLED for short), OLED has the characteristics of active light emission, high contrast, ultra-thin, low temperature resistance, fast response, low power consumption, wide viewing angle, strong shock resistance, etc. more applications. [0003] In related technologies, a display panel includes a display area and a binding area, and the display panel located in the binding area is bonded to a driver chip, so as to transmit electrical signals between the driver chip and the display panel. [0004] However, in the above-mentioned display panel, it is easy to have poor binding between the driving chip and the display panel, which affects the display effect of the display panel and the display device. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77H01L27/32
CPCH01L27/124H01L27/1259H10K59/12H10K59/1201
Inventor 谭兵吴春彦周琦
Owner HEFEI VISIONOX TECH CO LTD