Large-breadth laser hole cutting method for glass

Abstract

The invention relates to the field of material laser processing technologies, in particular to a large-breadth laser hole cutting method for glass, which comprises the following steps of: corroding a material by focusing a laser scanning beam on the lower surface of a glass workpiece; in the rapid scanning process of the focused laser beam, the three-dimensional motion platform drives the glass workpiece to move in an xy plane along a set cutting track to form a large-format kerf, after one-time scanning is completed, the three-dimensional motion platform moves the glass workpiece to move downwards, and the kerf is finally deepened in the glass thickness until the kerf penetrates through the glass; and after the kerf is penetrated, the excess material falls off to form a hole. Aiming at the defect that the current glass laser hole cutting cannot meet the requirement of large breadth, the invention provides a laser cutting method with the advantages of rapid formation of kerfs and large-breadth hole characteristics, and the laser hole cutting breadth is expanded to be more than 1m * 1m, so that the glass large-breadth laser hole cutting scheme can be applied to various glass processing industries.

Description

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AI Technical Summary

Benefits of technology

This technology allows for rapid formation of high aspect ratio (large) faces with wide range of sizes from one millimeters upwards through tens of micrometer dimensions. It also enables efficient production of larger windows without requiring expensive equipment like lithography tools that require precise alignment during manufacturing processes.

Problems solved by technology

This patented technical problem addressed in this patents relates to improving the efficiency and accuracy of laser cut processes when machining thin plate materials like solar panels. Current methods have limitations due to their designs that limit flexibility in adjustment options during production.

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