A method of improving the efficiency of chemical mechanical grinding

A chemical-mechanical, high-efficiency technology, applied in chemical instruments and methods, grinding machine tools, grinding devices, etc., can solve the problem of low chemical-mechanical grinding rate and achieve the effect of avoiding low overall grinding rate

Active Publication Date: 2022-04-22
SOI MICRO CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the problem of low chemical mechanical grinding rate or over grinding in the prior art, the present invention provides a method for improving the efficiency of chemical mechanical grinding, which can reduce consumption, reduce grinding time, improve grinding efficiency, and prevent different media from layer is over ground

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  • A method of improving the efficiency of chemical mechanical grinding
  • A method of improving the efficiency of chemical mechanical grinding
  • A method of improving the efficiency of chemical mechanical grinding

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[0043] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0044]It should be noted that the terms "comprising" and "having" in the description and claims of the present invention and the above drawings, as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, including a series of steps or units A process, method, device, product or device is not necessa...

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Abstract

The invention discloses a method for improving chemical mechanical grinding efficiency, which can reduce consumption, reduce grinding time, and improve grinding efficiency. The method is realized based on chemical mechanical grinding equipment, and is added step by step Grinding liquid and additives with inhibitory effect, through the step-by-step addition of the grinding liquid, the mixture of grinding liquid and additives, the different media layers of the parts to be ground are sequentially ground, and the different media layers include at least two layers: the first media layer, the second media layer Two media layers, the steps of grinding the parts to be ground sequentially include: S1, adding a grinding liquid to the grinding pad, grinding the first media layer through the grinding liquid, and when S2, the grinding of the first media layer is completed, adding to the grinding pad The additive is mixed with the grinding liquid to form a mixed liquid, and the second medium layer is ground through the mixed liquid.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for improving chemical mechanical polishing efficiency. Background technique [0002] With the upgrading of semiconductor process technology and the reduction of the size of wires and gates, photolithography technology has higher and higher requirements for the flatness of the wafer surface. At present, the commonly used method to improve the flatness of the wafer surface is chemical mechanical polishing (ie CMP), chemical mechanical polishing, also known as chemical mechanical polishing, mainly uses the processing method of the organic combination of physical grinding and chemical corrosion of nano-sized particles to smooth the surface of integrated circuit devices to meet the flatness requirements. At present, the surface of the wafer in the integrated circuit is polished with high precision through the CMP process, which can achieve a global leveli...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/3105C09K3/14B24B37/005B24B37/34B24B57/02
CPCH01L21/3105C09K3/14B24B37/005B24B37/34B24B57/02
Inventor 徐俊杰叶甜春朱纪军罗军李彬鸿赵杰
Owner SOI MICRO CO LTD
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