Electronic package, manufacturing method thereof and electronic structure

Abstract

An electronic package, a method of fabricating the same, and an electronic structure including an electronic structure as an integrated voltage regulator and a plurality of conductive posts embedded in a cladding layer to facilitate close-range cooperation with an electronic component for electrical transmission.

Description

technical field [0001] The invention relates to a semiconductor device, in particular to an electronic package and its manufacturing method and electronic structure. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. For example, integrated voltage regulators (IVRs) are embedded in high-performance processors to increase efficiency, such as switching frequency, reduce power consumption, and can improve reliability and even reduce manufacturing costs. At the same time, the technologies currently used in the field of chip packaging include, for example, Chip Scale Package (CSP for short), Direct Chip Attached (DCA for short) or Multi-Chip Module Packaging (Multi-Chip Package). Module (MCM for short) and other flip-chip packaging modules, or three-dimensional integrated circuit (3D IC) chip stacking technology that integrates three-dimensional...

AI Technical Summary

Problems solved by technology

[0010] However, with the demand of the consumer market, the functional requirements of terminal products are becoming more and more diverse, so more and more semiconductor chips 17 are connected to the packaging substrate 19, so the demand for the voltage regulator 1b matching it is greatly increased. As a result, there is no extra space on the underside of the package substrate 19 to configure more voltage regulators 1b, resulting in a single package structure 1 that can no longer meet the requirements of today's terminal products, such as light and thin, low power consumption, and high electrical performance.

[0011] In addition, although the regulator 1b can be integrated into the semiconductor chip 17, the packaging structure 1 needs to be redesigned, which not only increases the production cost, but also increases the size of the semiconductor chip 17, so it is difficult to meet the miniaturization requirements.

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