50results about How to "Raise the sensory value" patented technology

The invention discloses a power inductance element formed by molding. The power inductance element comprises a prefabricated magnetic core, a coil and a magnetic plastic package layer, wherein the coil is placed on the prefabricated magnetic core; the magnetic plastic package layer is formed by molding and is used for covering the magnetic core and the coil; and an electrode connected with the coil is exposed. The invention also discloses a method for manufacturing the power inductance element formed by molding. The method comprises the following steps of: a, prefabricating the magnetic core and placing the coil on the prefabricated core; and b, covering the magnetic plastic package layer on the magnetic core and the coil by virtue of molding and exposing the electrode connected with the coil. The power inductance product has the advantages of thinning, miniaturization and high reliability.

The invention provides an inductor structure used for a printed circuit board embedding technology, and belongs to the technical field of printed circuit integrated elements. According to the structure and the method, the inductance and the stability of the inductor in a usage process are increased through improvement of structures of magnetic cores and the surrounding mode of coils; according to the inductor structure, the occupied area of the copper coils on a PCB substrate can be reduced, the dimension micromation degree of inductor elements is improved, and the prepared inductor is advantaged by small size and high performance; and the inductor structure used for the printed circuit board embedding inductance technology is mainly formed by employing processes such as the pattern transfer technology, interlayer hole penetration, windowing processing, electroplating and electroless plating, and hot pressing layering etc., the manufacturing method is simple, the controllability is high, the inductor structure is compatible with the conventional process of the printed circuit board technology, and the integration degree of the elements of the printed circuit can be improved.

The invention provides a plastic molding power inductance element and a manufacturing method thereof. The plastic molding power inductance element comprises a conductor, a magnetic core and a magneticplastic packaging layer, wherein the conductor comprises a base part subjected to insulation treatment, a side edge enclosing part subjected to insulation treatment and an electrode part which are integrally formed, the base part and the side edge enclosing part are assembled together with the magnetic core in a gapless fit manner, and the magnetic plastic packaging layer wraps the conductor andthe magnetic core in a gapless manner. According to the invention, the method is used for manufacturing the plastic molding power inductance element; the plastic packaging layer completely wraps the prefabricated magnetic core and the part, except the electrodes, of the conductor and is of an integrally-formed structure, so that leakage flux is small; and when the equivalent magnetic conductivityreaches more than 60, the equivalent saturation magnetic flux density can reach more than 0.55 T, the space utilization rate is high, and the design of a miniaturized inductor is facilitated.

The invention provides a differential inductor which at least comprises a first port, a second port and a bottom coil. Inner and outer metal coils of the bottom coil are in cross connection through a plurality of first diagonal connectors. A top metal coil is formed right above the outmost metal coil of the bottom coil. The top metal coil is connected in parallel with the bottom coil through the first port, the second port and a plurality of contacts. Only the outmost metal layers of the top metal coil and the bottom coil are stacked, and the top metal coil and the bottom coil share all the metal coils of the bottom coil except the outmost metal coil. According to the inductor of the invention, the top metal coil and the bottom coil are connected in parallel, and only the outmost metal layers are stacked, so that the coupling capacitance is reduced; the thickness of the joint is increased, the energizing capability of the coils is improved, and the loss is reduced; and the Q value of the inductor can be integrally improved by more than 15% through joint action of the top metal coil and the bottom coil.

An adjustable on-chip inductor with a superhigh Q value comprises an inductor unit, a capacitance regulating and controlling unit and a negative resistance regulating and controlling unit. The inductor unit is provided with a primary inductor and a secondary inductor with electromagnetically coupled, and two ends of the primary inductor are connected with radio frequency output. The capacitance regulating and controlling unit is provided with two serially connected variable capacitors C1 and C2, the serial connection ends of the variable capacitors C1 and C2 are connected with an external control signal VC1, and the other ends of the variable capacitors C1 and C2 are respectively connected with an in-phase end and an inverse-phase end of the secondary inductor. The negative resistance regulating and controlling unit is provided with five transistors, a grid electrode of the transistor M1 is connected with an externally input control signal VC2, a source electrode of the transistor M1 is earthed, a drain electrode of the transistor M1 is connected together with source electrodes of the transistors M2 and M3, a grid electrode of the transistor M2 is connected together with drain electrodes of the transistors M3 and M5 and a grid electrode of the transistor M4 and the inverse-phase end of the secondary inductor, a grid electrode of the transistor M3 is connected together with drain electrodes of the transistors M2 and M4 and a grid electrode of the transistor M5 and the in-phase end of the secondary inductor, and source electrodes of the transistors M4 and M5 are connected with a power source VDD (voltage drain drain).

The invention discloses a laminated differential inductor with a top layer metal and a second layer metal of equal thickness. The laminated differential inductor has a multilayer structure and comprises an upper layer metal coil and a lower layer metal coil, wherein the upper layer metal coil and the lower layer metal coil have symmetric patterns and equal thickness; the metal coils are provided with inductance ports; in the inductor, the first layer of metal coil is spirally wound to the innermost end from one inductance port and then is connected with the other layer of metal coil through an interlayer through hole; the other layer of metal coil is spirally wound to the outermost end; and the upper layer metal coil is interconnected with the lower layer metal coil through the interlayer through hole. Since the mutual inductance between the symmetric upper layer metal and lower layer metal is fully utilized, the inductance of the inductor is effectively improved under the same area condition compared with the inductance of the conventional differential inductor. Both quality (Q) factor and inductance are obviously improved under the same area condition.

A wireless charging coil assembly includes a coil body, and the coil body includes a plurality of conductive coil layers arranged in longitudinal order and dielectric layers arranged between every twoadjacent conductive coil layers; each conductive coil layer includes a plurality of first conductive coil layers and at least one second conductive coil layer, each first conductive coil layer comprises at least one first coil segment, each second conductive coil layer comprises at least one second coil segment, projection of the first coil segment on each first conductive coil layer on the corresponding second conductive coil layer is spliced with the corresponding second coil segment to form a complete coil shape; the first coil segments corresponding to one other of different layers are connected in parallel with one other; the second coil segments corresponding to one other of the different layers are connected in parallel with one other; each of the first coil segments and each of the second coil segments are connected in series with each other. The wireless charging coil assembly of the invention adopts the form of multi-layer resistance coils being in parallel to reduce the impedance, and increases the inductance L through the coil segmentation, so as to improve the wireless charging efficiency.

The invention discloses a patch type integrally-formed inductor winding machine. The machine comprises an equipment machine table, a coil forming module is arranged in the middle of the upper end of the equipment machine table, and a jig transferring module, a finished product coil filling module, a waste wire collecting module, a coil shaping module, a coil transferring module, a wire taking module, a hot air conveying module, a wire feeding module and a control system are sequentially arranged in the circumferential direction with the coil forming module as the circle center. The winding machine has the beneficial effects that a copper wire is conveyed to the winding position through the wire taking module, a finished coil is conveyed to the shaping position after winding is completed, redundant copper wires are cut and collected after shaping is completed, the shaped coil is conveyed to the position above the jig, and after the jig is filled and a belt jig is in place, the coil is filled into the jig through the filling module. While the inductance value of the product is improved, the size of the product body is reduced, copper wire damage in the production process is reduced,and the machine table can achieve coil production and assembly to better meet market requirements.

The invention discloses an inductor bar and a manufacturing method thereof, and the inductor bar comprises at least one magnetic core; at least two conductors arranged on the magnetic core, wherein each conductor comprises a base part and an electrode part, the surface of each base part is insulated, and the conductors are assembled with the magnetic core through the base parts; a magnetic plasticpackage layer arranged on the magnetic core and the conductors, wherein the magnetic core and the conductor are both located in the magnetic plastic package layer, the magnetic core and the conductorare attached to the magnetic plastic package layer, and an electrode part of the conductor penetrates through the magnetic plastic package layer to be communicated with the outside. No air gap existsbetween the inner magnetic medium and the outer magnetic medium of the inductor bar, so that a high inductance value can be maintained under the condition of high current, almost no noise is generated under high frequency, and the reliability is high.

The invention discloses a three-dimensional polyhedral magnetic resonance wireless charging transmission device based on multi-antenna switching. The three-dimensional polyhedral magnetic resonance wireless charging transmission device comprises a magnetic resonance wireless electric energy transmitting module, a plurality of magnetic resonance transmitting antennas, a plurality of receiving antennas and a magnetic resonance wireless electric energy receiving module which are connected in sequence, the magnetic resonance wireless electric energy transmitting module is used for converting a direct-current power supply into the radio frequency energy and controlling a working mode; the magnetic resonance transmitting antenna is used for converting the radio frequency energy into a reactance field distributed in space; the receiving antenna is used for converting the reactance field into the radio frequency energy; and the magnetic resonance wireless electric energy receiving module is used for converting the radio frequency energy into a direct current power and charging or supplying power to a load. According to the present invention, the transmitting antennas are multiple groups of antennas, when one antenna is used as a main transmitting antenna, other antennas are used as relay coupling antennas, the transmitting and receiving antennas all adopt a three-dimensional multi-layer winding structure, the size difference of the transmitting and receiving antennas is larger, and the antenna is suitable for charging and supplying power to a micro device which is limited in cruising ability and cannot be supplied with power in a wired manner.

Method for manufacturing the disclosed inductor in high frequency includes steps: fixing up magnetic core on the ceramic base plate with leading out ends of metal; next, winding double lacquered wires on magnetic core; then, soldering double lacquered wires on leading out ends of metal so as to form duplex soldered points; finally, using ceramic package to enclosure protect to protect double lacquered wires and soldered points. Features are: reasonable design configuration, small size, large value of inductance, and high Q value. Being suitable to electronic products stuck assembled in high density and in mini type. Being reached to astronavigation level, the product possesses high reliability.

The invention discloses a circuit board packaging structure and a manufacturing method thereof. The circuit board packaging structure comprises a substrate with opposite first and second surfaces, an annular magnetic element, an adhesive layer, a plurality of conductive parts and a plurality of conductive channels. The first surface and the second surface are provided with a plurality of first metal parts and a plurality of second metal parts, respectively. An annular groove is formed in a position, not covered with the first metal part, on the first surface. The annular magnetic element is arranged in the annular groove. The adhesive layer is located on the first surface and covers the first metal parts and the annular magnetic element. The conductive parts are formed on the adhesive layer and correspond to the second metal parts, respectively. The conductive channels penetrate through the conductive parts, the adhesive layer and the substrate, and are located in the inner wall and outside the outer wall of the annular groove, respectively. Each conductive channel is provided with a conductive film for electrically connecting each conductive part and the corresponding second metal part.

The invention belongs to the technical field of passive integrated devices, and particularly provides an on-chip magnetic core power inductor with an inductance value changing along with working current. The inductor is applied to a switching power supply to solve the problem that the switching power supply cannot keep low ripple current and good transient response capability at the same time, and does not need additional components or control circuits. In the invention, an anisotropic magnetic core film adopts an [insulating layer/lower buffer layer/lower antiferromagnetic layer/lower ferromagnetic layer/upper buffer layer/upper ferromagnetic layer/upper antiferromagnetic layer]n multi-layer film structure, and the magnetic core film has lower magnetic conductivity in a low field and higher magnetic conductivity in a high field by utilizing the effect of an anti-parallel exchange bias field between layers of the magnetic core film; when the direct current bias of the inductor is relatively high, the inductor has a relatively large inductance value, so that the ripple current is reduced; and when the power supply is in a turn-on (turn-off) state, the current value on the inductor is relatively small, the inductance value is relatively low, and the transient response capability is improved.

The embodiment of the invention provides an inductor, an inductor package, a conversion circuit and a processing method. The inductor comprises a first wiring layer provided with at least one section of first wiring; the second wiring layer is provided with at least one section of second wiring; the substrate is arranged between the first wiring layer and the second wiring layer; a first connection end and a second connection end; wherein the at least one section of first wire and the at least one section of second wire penetrate through the substrate and are connected in series to form a winding wire, and the winding wire is arranged between the first connecting end and the second connecting end. In the scheme of the embodiment of the invention, the at least one section of the first wire and the at least one section of the second wire are positioned on different wire layers, so that effective arrangement of the winding wire formed by penetrating through the substrate in series is realized, and the inductance value of the inductor is improved.