Circuit board packaging structure and manufacturing method thereof

Abstract

The invention discloses a circuit board packaging structure and a manufacturing method thereof. The circuit board packaging structure comprises a substrate with opposite first and second surfaces, an annular magnetic element, an adhesive layer, a plurality of conductive parts and a plurality of conductive channels. The first surface and the second surface are provided with a plurality of first metal parts and a plurality of second metal parts, respectively. An annular groove is formed in a position, not covered with the first metal part, on the first surface. The annular magnetic element is arranged in the annular groove. The adhesive layer is located on the first surface and covers the first metal parts and the annular magnetic element. The conductive parts are formed on the adhesive layer and correspond to the second metal parts, respectively. The conductive channels penetrate through the conductive parts, the adhesive layer and the substrate, and are located in the inner wall and outside the outer wall of the annular groove, respectively. Each conductive channel is provided with a conductive film for electrically connecting each conductive part and the corresponding second metal part.

Description

technical field [0001] The invention relates to a circuit board packaging structure and a manufacturing method thereof. Background technique [0002] Generally speaking, during the manufacturing process of the circuit board, specific components, such as copper blocks and iron cores for heat dissipation, need to be placed into the predetermined accommodation slots of the circuit board. The iron core can be applied to the structure of a transformer or a choke because of its magnetic properties. Magnetic components are very sensitive to stress. The electrical characteristics of magnetic components may be affected by the stress caused by the environment and even lead to damage. The existing manufacturing process and packaging structure itself will generate stress that affects the inductance. [0003] The existing circuit board has a four-layer packaging structure, and uses a copper clad laminate (CCL) with copper on both front and back sides as the substrate. When making a cir...

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Problems solved by technology

[0004] However, before laminating the copper foil on the back of the substrate, it is necessary to etch and remove all the copper on the back of the copper foil substrate, which causes a waste of material and manufacturing process time, and the thickness of the copper foil is smaller than that of the copper on the back of the substrate, so it will reduce four The strength of the multi-layer circuit board structure produces stress that affects the inductance

[0005] In addition, when the subsequent circuit board undergoes Surface Mount Technology (SMT), the gas in the holding tank is easy to expand due to the high temperature of the infrared reflow furnace (IR Reflow), so that the adhesive layer covering the substrate and the epoxy Resin damage, unless high-quality glue is used to avoid the above situation, but will increase the cost

On the other hand, the board material of the substrate is glass fiber. When making conductive channels, it is easy to ignore that the position of adjacent channels may be located parallel to the direction of the glass fiber of the substrate.

In this way, the distance along the glass fiber between adjacent channels is the shortest distance, and the cracks generated when the adjacent channels are drilled in the substrate are easy to connect along the glass fiber, so that the copper on the wall of the adjacent channel may be conducted through the crack, resulting in short circuit

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