Laminated differential inductor with top layer metal and second layer metal of equal thickness

Abstract

The invention discloses a laminated differential inductor with a top layer metal and a second layer metal of equal thickness. The laminated differential inductor has a multilayer structure and comprises an upper layer metal coil and a lower layer metal coil, wherein the upper layer metal coil and the lower layer metal coil have symmetric patterns and equal thickness; the metal coils are provided with inductance ports; in the inductor, the first layer of metal coil is spirally wound to the innermost end from one inductance port and then is connected with the other layer of metal coil through an interlayer through hole; the other layer of metal coil is spirally wound to the outermost end; and the upper layer metal coil is interconnected with the lower layer metal coil through the interlayer through hole. Since the mutual inductance between the symmetric upper layer metal and lower layer metal is fully utilized, the inductance of the inductor is effectively improved under the same area condition compared with the inductance of the conventional differential inductor. Both quality (Q) factor and inductance are obviously improved under the same area condition.

Description

technical field [0001] The invention relates to the field of microelectronics, in particular to a differential inductor using a stacked structure. Background technique [0002] At present, a large number of passive devices are included in integrated circuits, among which on-chip inductors are a very important one, and on-chip inductors are one of the important components of radio frequency CMOS / BiCMOS integrated circuits. In typical wireless products, inductive components have a significant impact on the overall RF performance. Therefore, the design and analysis of these inductive components have also been extensively studied. As the core component of the RF circuit, the inductor can usually affect the overall performance of the entire circuit. At present, on-chip inductors with high quality factors are widely used in RF circuit modules such as voltage-controlled oscillators and low-noise amplifiers. The stacked on-chip inductor greatly reduces the chip area and reduces t...

AI Technical Summary

Problems solved by technology

However, in order to obtain a large inductance value, the inductor of the traditional differential structure still needs a relatively large area

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