a differential inductor

A differential inductor and coil technology, applied in the field of differential inductors, can solve the problem of low quality factor Q value of differential inductors, and achieve the effects of increasing thickness, reducing connection resistance and improving Q value.

Active Publication Date: 2017-12-29
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a differential inductor for solving the problem of low quality factor Q of differential inductors in the prior art

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  • a differential inductor
  • a differential inductor
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Embodiment Construction

[0038] The embodiments of the present invention are described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0039] see Figure 4 to Figure 7 . It should be noted that the drawings provided in this embodiment are only to illustrate the basic concept of the present invention in a schematic way, so the drawings only show the components related to the present invention rather than the number, shape and the number of components in actual implementation. For dimension drawing, the type, quantity and proportion of each component can be arbitrarily chang...

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Abstract

The present invention provides a differential inductor, at least comprising: a first port, a second port and a bottom coil; the inner and outer metal coils of the bottom coil are connected in a crossing manner through a number of first oblique connecting pieces; the bottom coil A top layer metal coil is formed directly above the outermost metal coil of the coil; the top layer metal coil is connected in parallel with the bottom layer coil through the first port, the second port, and several contacts; the top layer metal coil Only the outermost metal coil is stacked between the coil and the bottom coil and shares all the metal coils in the bottom coil except the outermost metal coil. In the inductor of the present invention, the top-layer coil and the bottom-layer coil are connected in parallel and only the outermost metal coil is stacked, which reduces the coupling capacitance; at the same time, the thickness of the connection is increased, which improves the power-carrying capacity of the coil and reduces loss; the two work together to achieve overall Boost the inductor Q by more than 15%.

Description

technical field [0001] The invention belongs to the field of semiconductors and relates to a differential inductor. Background technique [0002] At present, a large number of passive devices are included in integrated circuits, and on-chip inductors are one of the most important ones. On-chip inductors are one of the important components of RF CMOS / BiCMOS integrated circuits. In typical wireless products, inductive components have a significant impact on the overall RF performance. Therefore, the design and analysis of these inductive components have also been extensively studied. As the core component of RF circuits, inductors can usually affect the overall performance of the entire circuit. At present, on-chip inductors with high quality factor are widely used in RF circuit modules such as voltage-controlled oscillators and low-noise amplifiers. The inductance quality factor Q value is the main parameter to measure the inductive device, which refers to the ratio of the...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/522H01F17/00H01F27/28
Inventor 刘凌程仁豪王西宁
Owner SEMICON MFG INT (SHANGHAI) CORP
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