Laminating process of multi-layer circuit board

A multi-layer circuit board and lamination process technology, which is applied in multi-layer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve problems such as defects in the electrical conductivity of circuit boards, avoid delamination and explosion boards, and increase the electrification rate , enhance the binding effect

Active Publication Date: 2018-11-06
赣州中盛隆电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The manufacturing process of the multilayer circuit board in the above patent has defects in improving the electrical conductivity between the circuit boards in the multilayer circuit board

Method used

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  • Laminating process of multi-layer circuit board

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Comparison scheme
Effect test

Embodiment 1

[0023] A lamination process for a multilayer circuit board, the process comprising:

[0024] (1) Pre-machine: Preheat the laminator to a temperature of 130°C;

[0025] (2) Component preparation: Lay single-layer circuit board, thermosetting adhesive film, graphene sheet, thermosetting adhesive film, single-layer circuit board, thermosetting adhesive film, graphene sheet, thermosetting adhesive film, layer circuit board to form a multi-layer circuit board assembly;

[0026] (3) Negative pressure lamination stage: open the laminator, place the prepared circuit board assembly in the laminator, then close the lid of the laminator, vacuum the upper chamber of the laminator, and vacuum the upper chamber of the laminator, Keep the vacuum at -75kpa, the process lasts for 30s, the lower chamber of the laminator starts to vacuum, keep the vacuum at -58kpa, and last for 200s;

[0027] (4) Positive pressure lamination stage: the upper chamber of the laminator starts to inflate, and the ...

Embodiment 2

[0032] A lamination process for a multilayer circuit board, the process comprising:

[0033] (1) Pre-machine: Preheat the laminator to a temperature of 130°C;

[0034] (2) Component preparation: Lay single-layer circuit board, thermosetting adhesive film, graphene sheet, thermosetting adhesive film, single-layer circuit board, thermosetting adhesive film, graphene sheet, thermosetting adhesive film, layer circuit board to form a multi-layer circuit board assembly;

[0035] (3) Negative pressure lamination stage: open the laminator, place the prepared circuit board assembly in the laminator, then close the lid of the laminator, vacuum the upper chamber of the laminator, and vacuum the upper chamber of the laminator, Keep the vacuum at -75kpa, the process lasts for 30s, the lower chamber of the laminator starts to vacuum, keep the vacuum at -70kpa, and last for 220s;

[0036] (4) Positive pressure lamination stage: the upper chamber of the laminator starts to inflate, and the ...

Embodiment 3

[0041] A lamination process for a multilayer circuit board, the process comprising:

[0042] (1) Pre-machine: Preheat the laminator to a temperature of 130°C;

[0043](2) Component preparation: Lay single-layer circuit board, thermosetting adhesive film, graphene sheet, thermosetting adhesive film, single-layer circuit board, thermosetting adhesive film, graphene sheet, thermosetting adhesive film, layer circuit board to form a multi-layer circuit board assembly;

[0044] (3) Negative pressure lamination stage: open the laminator, place the prepared circuit board assembly in the laminator, then close the lid of the laminator, vacuum the upper chamber of the laminator, and vacuum the upper chamber of the laminator, Keep the vacuum at -75kpa, the process lasts for 30s, the lower chamber of the laminator starts to vacuum, keep the vacuum at 90kpa, and last for 250s;

[0045] (4) Positive pressure lamination stage: the upper chamber of the laminator starts to inflate, and the mo...

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Abstract

The invention discloses a laminating process of a multi-layer circuit board. The laminating process of the multilayer circuit board comprises pre-machine, component preparation, negative pressure lamination, positive pressure lamination, discharge, conductive filling and surface coating. Graphene sheets are added to the multi-layer circuit board in the process, and the conductive resistance amongthe multiple layers of circuit boards decreases sharply, therefore, the conductivity among the multiple layers of circuit boards is greatly increased, and the performances such as the conductivity ofthe multi-layer circuit board prepared with the process is greatly improved; meanwhile, through the double treatment of positive and negative pressure, the bonding force among the layers of the circuit board is strengthened, and the lamination and explosion of the board are avoided to a certain extent.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a lamination process of a multilayer circuit board. Background technique [0002] A multilayer circuit board generally includes at least two circuit layers, and an insulating layer is provided between two adjacent circuit layers. When manufacturing a multilayer circuit board, there are two main methods for connecting lines between different circuit layers: one is Connection through via holes, that is, drilling holes in the insulating layer between the two layers of circuit layers that need to be connected, and plating metal (such as copper) in the holes to connect lines of different layers; the other is through conductive pillars To connect, that is, when adding layers to a multilayer circuit board, it is necessary to first form a conductive column layer, then laminate an insulating layer on the conductive column layer, and then make a circuit layer on the formed insulatin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4614
Inventor 揭添增古云生高永忠石磊宋自成
Owner 赣州中盛隆电子有限公司
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