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Packaging structure, electrical equipment and design method of packaging structure

A technology of packaging structure and design method, applied in the field of packaging, can solve the problems of design defects, reduction of packaging structure strength, impact on buffering effect, etc.

Pending Publication Date: 2022-04-12
GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the overall low density will cause the structural strength of the package to decrease, affecting its cushioning effect, resulting in design flaws and failing internal testing

Method used

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  • Packaging structure, electrical equipment and design method of packaging structure
  • Packaging structure, electrical equipment and design method of packaging structure
  • Packaging structure, electrical equipment and design method of packaging structure

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Embodiment Construction

[0058] In order to better understand the above-mentioned purpose, features and advantages of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0059] In the following description, many specific details are set forth in order to fully understand the application, but the application can also be implemented in other ways different from those described here, therefore, the protection scope of the application is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

[0060] Refer below Figure 1 to Figure 12 Describe the packaging structure, electrical equipment, and packaging structure design method provided by some embodiments of the present application.

[0061] The packaging struct...

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Abstract

The invention provides a packaging structure, electrical equipment and a design method of the packaging structure. The packaging structure comprises at least one foam plastic piece, the foam plastic piece comprises at least two foam plastic parts, and the adjacent foam plastic parts are different in density, so that the foam plastic piece is provided with at least two stress areas, and the adjacent stress areas are suitable for bearing different acting forces. According to the packaging structure, the variable-density packaging design is adopted, the density and quality of the packaging structure can be optimized on the basis of an original packaging structure, the existing design limit is broken through, the overall cost of the packaging structure is further reduced, and therefore more economic benefits are brought to enterprises.

Description

technical field [0001] The present application relates to the technical field of packaging, in particular, to a packaging structure, an electrical device, and a design method of the packaging structure. Background technique [0002] As a packaging material, foamed plastic is widely used in traditional home appliances. In general, high-density foams are suitable for heavier products, while low-density foams are suitable for lighter products. Therefore, the existing cost reduction method of foam plastic packaging is to match the overall density of the packaging, aiming at the shape and quality of the product, to match the most suitable density to reduce costs. However, with the further control of packaging costs on the product side, a higher demand for packaging cost reduction has been put forward. However, the overall low density will cause the structural strength of the package to decrease, affecting its cushioning effect, resulting in design flaws and failing internal tes...

Claims

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Application Information

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IPC IPC(8): B65D81/05B65D85/68
Inventor 汪月吴延岐周宇雷忠琦唐相伟
Owner GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD