A kind of ultraviolet device packaging structure

Abstract

The invention provides an ultraviolet device packaging structure, which relates to the technical field of semiconductor packaging structure, including: a base, a light cup, an ultraviolet LED light-emitting diode chip, a protection chip and a detection chip, the front side of the base is provided with a front circuit layer, and the back side is provided with a power supply pad ; The inner wall of the light-emitting cup is a concentrating reflective surface, and the two ends of the light-emitting cup are open. One end of the light-emitting cup is the light outlet, and the other end is fixed on the front of the substrate; the ultraviolet LED light-emitting diode chip, protection chip and detection chip are all set on the front line. The functional area of ​​the layer; the detection chip and the protection chip are located on the side of the ultraviolet LED light-emitting diode chip away from the light outlet, and the detection chip is used to receive the photons of the ultraviolet light emitted by the ultraviolet LED light-emitting diode chip and output them to the amplification circuit outside the device The analysis and judgment of the amount of radiation is done in the middle, and the lens is fixedly arranged at the light outlet; the packaging structure of the ultraviolet device provided by the present invention can enhance and ensure the disinfection effect.

Description

A UV device packaging structure technical field [0001] The present invention relates to the technical field of semiconductor packaging structures, in particular to a packaging structure for ultraviolet devices. Background technique Deep ultraviolet light emitting diode (UVC LED) has high reliability, long life, fast response, low power consumption, environmental protection and pollution-free. The advantages of dyeing and small size; it is worth noting that the current TE light emission on the front of the deep ultraviolet light-emitting diode chip is weaker than that of the side TM Due to the material and structure of the deep ultraviolet light emitting diode chip, the deep ultraviolet light emitting diode chip is resistant to The electrostatic capacity is weak, and special anti-static diodes are required for parallel protection of LED chips. The conventional packaging structure is protection diodes. The LED chip is placed in the parallel circuit of the ultraviolet L...

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Problems solved by technology

[0002] Deep ultraviolet light-emitting diodes (UVC LEDs) have the advantages of high reliability, long life, fast response, low power consumption, environmental protection and pollution-free, and small size. The light radiates energy, and due to the material and structure of the deep ultraviolet light emitting diode chip, the antistatic ability of the deep ultraviolet light emitting diode chip is weak, and special antistatic diode LED chips are required to be connected in parallel for protection. The conventional packaging structure is to protect the diode LED chip and place it in the ultraviolet LED In the parallel circuit of light-emitting diode chips, the distance to the deep-ultraviolet light-emitting diode chip is relatively close, which affects the light emission of the deep-ultraviolet light-emitting diode chip on the corresponding side of the protective diode LED chip, causing shading and absorption;

[0003] In addition, after the deep ultraviolet LED light-emitting diode LED chip is packaged, it is widely used in water sterilization, air sterilization, surface sterilization and other fields. In order to ensure the sterilization effect, it is necessary to continuously output the dose of deep ultraviolet radiation to achieve disinfection. However, due to the increase in the use time of the deep ultraviolet light-emitting diode LED chip or the environment in which it is located, the light radiation energy emitted by the light-emitting diode LED chip will attenuate, and the radiation energy will become lower, so that the deep ultraviolet light required for sterilization and disinfection cannot be met. radiation dose, thereby reducing the quality of disinfection, therefore, there is an urgent need for a new UV device packaging structure to solve the above problems

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