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Multi-point heat dissipation loop heat pipe

A loop heat pipe, multi-point technology, used in indirect heat exchangers, lighting and heating equipment, electrical components, etc., can solve the problems of limited heat exchange capacity of loop heat pipes, inability to achieve independent heat dissipation at multiple points, and achieve good flexibility , the effect of power generation balance and prolonging battery life

Active Publication Date: 2022-04-19
SHANDONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention provides a new multi-point heat dissipation loop heat pipe, which solves the limitation of the heat exchange capacity of the multi-point heat dissipation loop heat pipe and cannot realize multi-point independent heat dissipation technical issues

Method used

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  • Multi-point heat dissipation loop heat pipe
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Embodiment Construction

[0028] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0029] In this article, if there is no special explanation, when it comes to formulas, " / " means division, and "×" and "*" mean multiplication.

[0030] figure 1 A loop heat pipe for multi-point heat dissipation is disclosed. like figure 1 As shown, a loop heat pipe with multi-point heat dissipation includes an evaporator 1 and a condenser, and the condenser includes at least two, which are a first condenser 21 and a second condenser 22, and the first condenser 21 and the second condenser The device 22 is arranged on the first condenser pipeline 31 and the second condenser pipeline 32 respectively, the first condenser pipeline and the second condenser pipeline are connected in parallel, and the evaporator pipeline 11 where the evaporator 1 is located The first condenser line 31 and the second condenser line 32 are respectively connected...

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Abstract

The invention provides a multi-point heat dissipation loop heat pipe which comprises an evaporator and two condensers, the two condensers are the first condenser and the second condenser, the first condenser and the second condenser are arranged on a first condenser pipeline and a second condenser pipeline respectively, the first condenser pipeline and the second condenser pipeline are connected in parallel, and the first condenser pipeline and the second condenser pipeline are connected in parallel. The evaporator pipeline where the evaporator is located is connected with the first condenser pipeline and the second condenser pipeline. The invention provides a novel multi-point heat dissipation loop heat pipe, and solves the technical problems that a multi-point heat dissipation loop heat pipe is limited in heat exchange capacity, and multi-point independent heat dissipation cannot be achieved.

Description

technical field [0001] The invention relates to a heat pipe technology, in particular to a multi-point heat dissipation loop heat pipe, which belongs to the heat pipe field of F28d15 / 02. Background technique [0002] Heat pipe technology is a heat transfer element called "heat pipe" invented by George Grover of Los Alamos National Laboratory in the United States in 1963. It makes full use of the principle of heat conduction and phase change medium. The rapid heat transfer properties of the heat pipe quickly transfer the heat of the heating object to the heat source, and its thermal conductivity exceeds that of any known metal. [0003] Heat pipe technology was widely used in aerospace, military and other industries before. Since it was introduced into the radiator manufacturing industry, people have changed the traditional radiator design ideas and got rid of the single heat dissipation mode that only relies on high air volume motors to obtain better heat dissipation. The u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02H02N11/00C08J7/14C08J7/12C08L65/00C08L25/18
CPCF28D15/0266H02N11/002C08J7/14C08J7/12C08J2365/00C08J2425/18C08J2325/18C08J2465/00
Inventor 韩昊宸王学良田鑫王君豪李华杰刘淼郭春生李蒸黑吉芳侯蕊李文涵
Owner SHANDONG UNIV
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