VC vapor chamber cover plate heat dissipation module

Abstract

The invention relates to the technical field of heat dissipation. The invention aims to provide a VC vapor chamber cover plate heat dissipation module. The VC vapor chamber cover plate heat dissipation module comprises a first vapor chamber; the first vapor chamber comprises an upper cover plate and a lower cover plate; a supporting mesh plate and a main body capillary layer are sequentially arranged on the inner surface of the lower cover plate in the direction away from the upper cover plate, a plurality of rows of supporting columns are evenly arranged between the plate face of the upper cover plate and the plate face of the lower cover plate, and the two ends of each supporting column make contact with the inner surface of the upper cover plate and the supporting mesh plate in the lower cover plate correspondingly. A column surface capillary layer is arranged on the outer surface of the supporting column. According to the vapor chamber, a more convenient path can be provided for backflow of a working medium, the backflow stroke of part of the working medium is shortened, and then the heat dissipation performance of the vapor chamber is effectively guaranteed.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a VC vapor chamber cover plate heat dissipation module. Background technique [0002] In recent years, with the rapid development of electronic information technology-related industries, various highly integrated and high-power electronic devices have been continuously applied to smart devices such as mobile phones and tablets. At the same time, in order to ensure the stable working conditions of the equipment, ensure The performance of the equipment has higher and higher requirements for the heat dissipation module. The vapor chamber is a heat dissipation device widely used in mobile phones and tablets. It has the advantages of good heat dissipation effect and strong product adaptability. [0003] The traditional vapor chamber usually includes a copper upper cover and a lower cover. The upper cover and the upper cover are welded and closed to form a vacuum chamber, and...

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Problems solved by technology

[0006] 2. The capillary structure of the traditional vapor chamber is generally a very thin capillary copper mesh. The pores of each part of this capillary copper mesh are uniform, that is to say, the capillary adsorption force of each position of the whole capillary copper mesh is roughly the same. Under normal usage conditions, this kind of capillary copper mesh can basically meet the usage requirements.

However, due to the small size of the vapor chamber, the contact area between the upper cover and the heat dissipation backplane is limited. When the equipment is running at high power and high frequency, the small contact area between the upper cover and the heat dissipation backplane cannot guarantee the heat The rapid transfer of heat will lead to local heat dissipation on the heat dissipation backplane, causing local heating of the equipment, and also affecting the condensation of the working medium in the vapor chamber on the upper cover, resulting in a vicious circle of heat dissipation

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