High-integration-level vertical wireless light emitting module

Abstract

A high-integration-level vertical wireless light emitting module comprises a shell and a printed board arranged in the shell, a heat conduction block is arranged on the printed board in a penetrating mode, the inner side face of the heat conduction block dissipates heat through the shell, a plurality of optical active devices are arranged on the outer side face of the heat conduction block, and a driving chip is arranged on the heat conduction block on the periphery of the optical active devices. The optical active device, the driving chip and the printed board are connected through gold wire bonding; the printed board is provided with array lenses which cover the optical active devices and the driving chip and can perform optical signal transmission with the outside of the shell, each lens on the array lenses is coaxially coupled with the corresponding optical active device, and each optical active device is located at the focus position of the corresponding lens in the array lenses. The optical active device is bonded on the heat conduction block, the array lens is used for light beam shaping, high-precision coupling packaging is carried out through the micro-assembly platform, the problem that an existing product is provided with an MT tail fiber is solved, and parallel optical module cableless communication is achieved.

Description

technical field [0001] The invention belongs to the technical field of wireless optical communication, and in particular relates to a highly integrated vertical wireless optical output module. Background technique [0002] In the military field, all kinds of signal lines are very complicated, and fiber optic cables and radio frequency cables are intertwined, and there are many problems. Therefore, there is a demand for cableless, integrated (active integration, multi-signal connection integration), miniaturization, and high-density overall interconnection links. Currently used parallel optical modules have problems such as large volume and low integration. In the future, the platform chassis will be developed in the direction of small size, high integration, high speed, and low weight. Therefore, the existing parallel optical modules cannot meet the above requirements and become a major obstacle to the development of aviation, aerospace, and electronics. [0003] Such as ...

AI Technical Summary

Problems solved by technology

The product is welded on the printed board when in use, and the MT pigtail is inserted into the connector at the same time. The length of the MT pigtail needs to be strictly controlled during the connection process. In addition, the pigtail of the parallel optical module occupies the area of ​​the sub-board and can be used in the compressor box. Space

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