Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer yield data processing method and device

A technology of wafer yield rate and processing method, applied in the direction of electrical digital data processing, input/output process of data processing, instruments, etc., can solve problems such as inability to process wafer yield rate data, and achieve the purpose and advantages of being concise and easy to understand Effect

Active Publication Date: 2022-04-26
SEMITRONIX
View PDF9 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present application provides a method and device for wafer yield data processing, so as to at least solve the problem that the wafer yield data cannot be processed in the related art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer yield data processing method and device
  • Wafer yield data processing method and device
  • Wafer yield data processing method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application. In addition, it can also be understood that although such development efforts may be complex and lengthy, for those of ordinary skill in the art relevant to the content disclosed in this application, the technology disclosed in this application Some design, manufacturing or production changes based on the content are just conventional technical means, and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a wafer yield data processing method and device.The method comprises the steps that a main display assembly and at least one slave display assembly are displayed in a data visualization interface, and the main display assembly comprises a chart assembly capable of displaying the wafer yield and / or the yield related parameter trend in multiple data dimensions; in response to a screening operation of a user on at least one data dimension in the chart component, obtaining a screened data range; determining corresponding data results of the data range in the main display component and the at least one slave display component; and respectively adjusting display results in the main display component and the at least one slave display component according to the data result.

Description

technical field [0001] The present application relates to the technical field of semiconductor data processing, in particular to a method and device for processing wafer yield data. Background technique [0002] Chips are cut vertically and horizontally from the wafer. Depending on the size of the chip, hundreds, thousands or even tens of thousands of chips can be cut from a wafer. Only effective chips that can meet the design performance and function requirements can be delivered for use; effective The ratio of chips to the total number of chips on a wafer is called yield or yield. The higher the yield rate, the higher the commercial value of a wafer. If the yield rate is low, it means that the manufacturing process is not yet mature, and the product cannot enter mass production. The key to improving chip yield lies in the complete and effective monitoring and testing of the manufacturing process, combined with other data in the manufacturing process for accurate and rapi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/0481G06F3/04847
CPCG06F3/0481G06F3/04847Y02P90/30
Inventor 杨文浩邵康鹏
Owner SEMITRONIX
PatSnap Eureka logo

PatSnap Eureka turns technology decisions into work you can execute. Powered by our Innovation Knowledge Graph, it runs expert workflows across engineering, life sciences, materials and intellectual property. Get your review-ready output in minutes.

X (Twitter)LinkedInYouTubeSubstack

© 2026 PatSnap. All rights reserved. 

Terms of Service

 | 

Privacy policy

 | 

Modern Slavery Act Transparency Statement