Display module manufacturing method, display module and display screen
A technology for display modules and manufacturing methods, which is applied to identification devices, instruments, semiconductor devices, etc., can solve the problems of difficult molding packaging process, high cost of molding packaging, and low efficiency, and achieve low cost, high manufacturing efficiency, and easy implementation Effect
Pending Publication Date: 2022-05-06
HCP TECH CO LTD
View PDF23 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the molded packaging process is difficult, difficult to implement, low in efficiency, and the cost of molded packaging is high
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0021] In order to describe the content, structural features, goals and effects of the present invention in detail, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described implementation Examples are only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0022] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "row", "column" etc. is based on the orientation or positional relationship shown in the drawings, and is only for It is convenient to describe the present invention and ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a display module manufacturing method, which comprises the following steps of: covering a first region of a display panel with a first adhesive layer, forming a first barrier wall for a second region of the display panel, enabling the first region to comprise the upper surface of a light-emitting chip, enabling the first adhesive layer to penetrate through light rays emitted by the light-emitting chip, and then adding flowable flowing adhesive in the second region, forming a second adhesive layer covering the second area; the first adhesive layer covers the upper surface of the light-emitting chip, so that the flowing adhesive can be blocked, and the flowing adhesive is prevented from flowing to the upper surface of the light-emitting chip to influence light emission of the light-emitting chip. According to the invention, the packaging adhesive layer is divided, the manufacturing process is simple and easy to realize, the high manufacturing efficiency can be obtained, and the cost is low. In addition, the invention further discloses the display module manufactured by adopting the manufacturing method and a display screen comprising the display module.
Description
technical field [0001] The invention relates to the field of display technology, in particular to a method for manufacturing a display module, a display module and a display screen. Background technique [0002] At present, in the field of Mini-LED RGB full-color display, in order to make the ink color of the black matrix area of the display module after the light-emitting chip is extinguished and the ink color of the light-emitting chip area as consistent as possible, the existing technology proposes the use of molded packaging technology, in the array of light-emitting chips and black color. The upper surface of the matrix is integrally formed with a black encapsulation layer. However, the molded packaging process is difficult, difficult to implement, low in efficiency, and the cost of molded packaging is high. Contents of the invention [0003] The purpose of the present invention is to provide a low-cost and simple process for manufacturing a display module, a dis...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L33/52H01L25/075G09F9/33
CPCH01L33/52H01L25/0753G09F9/33H01L2933/005
Inventor 吕玉龙朱发明林长树付小朝庄文荣
Owner HCP TECH CO LTD