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Manufacturing method of CSP

A manufacturing method and colloid technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems affecting production efficiency, material jamming, etc., and achieve the effects of improving production efficiency, simple implementation method, and low cost

Active Publication Date: 2019-04-19
HONGLI ZHIHUI GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the stickiness of the fluorescent colloid on the surface of the CSP, the surfaces of the CSP that fall chaotically in the loading tray will stick to each other, so the phenomenon of material jams often occurs, which seriously affects the production efficiency

Method used

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  • Manufacturing method of CSP
  • Manufacturing method of CSP

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings of the description.

[0024] Such as figure 1 Shown, a kind of manufacturing method of CSP comprises the following steps:

[0025] (1) Lay UV high-temperature tape 2 on the carrier board 3, and solidify the crystal on the UV high-temperature tape 2, the distance between adjacent chips 1 is equal, and the carrier board 3 is a glass plate;

[0026] (2) Mold a layer of fluorescent colloid 4 on the carrier plate 3, the fluorescent colloid 4 covers the light-emitting surfaces of all chips; the temperature required for molding the fluorescent colloid 4 is 90-100°C, and the required time is 8-12min. The present embodiment selects 100 ℃ and 10min;

[0027] (3) After the fluorescent colloid 4 is molded, it needs to be baked at 130~160°C for 2.5~3.5h, and 150°C and 3h are used in this embodiment;

[0028] (4) Carrier 3 is cut according to the size to form a single CSP 5 , with a...

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Abstract

The invention provides a manufacturing method of a CSP, comprising the steps of: (1) forming a single-body CSP on a carrying board through cutting, and providing a gap between adjacent CPSs, wherein each CSP includes a top face light emitting face and a side face light emitting face; (2) spraying release agent on the surface of each CSP; and (3) dropping the CPSs on the carrying board into a carrying disc for carrying out light splitting and braiding, wherein since the CSP surfaces are coated with the release agent, colloid on the CSP surfaces are prevented from being adhered to each other toclamp the materials in the light splitting and package carrying disc. According to the invention, a layer of release agent is sprayed on the surface of the CSP before the CSP falls into the carrying tray, and the release agent packages the surface of the CSP, so that the colloid is no longer adhered to each other, and the mutually-stacked CSPs in the carrying tray will not be adhered to each other, thereby solving the phenomenon of material clamping and improving production efficiency. In addition, it should be noted that the release agent is volatile, and does not affect the colloid on the CSP surfaces and light emission, and the whole implementation method is simple and the cost is low.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a method for manufacturing CSP. Background technique [0002] In the CSP manufacturing process, firstly, it is necessary to solidify the crystal on the carrier plate, then mold a layer of fluorescent colloid on the carrier plate to cover the chip, then cut the fluorescent colloid to obtain a single CSP, and drop the CSP into the loading tray for light splitting, taping. Due to the stickiness of the fluorescent colloid on the surface of the CSP, the surfaces of the CSP that fall chaotically in the loading tray will stick to each other, so the phenomenon of material jams often occurs, which seriously affects the production efficiency. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a CSP manufacturing method, which can solve the material jam phenomenon caused by the mutual adhesion of CSPs and improve production efficiency. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56
CPCH01L33/56H01L2933/005
Inventor 黄巍徐炳健
Owner HONGLI ZHIHUI GRP CO LTD