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Headband for headphone and method for assembling headband for headphone

A headphone and headphone technology, which is applied in the direction of headphone manufacturing/assembly, on-ear/over-ear headphones, earpiece/headphone accessories, etc. Number of parts, effect of maintaining integrity

Pending Publication Date: 2022-07-01
GN AUDI GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The problem with prior art solutions is that the headgear consists of several different interconnected parts, complicating the interchangeability of the headgear and its appearance

Method used

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  • Headband for headphone and method for assembling headband for headphone
  • Headband for headphone and method for assembling headband for headphone
  • Headband for headphone and method for assembling headband for headphone

Examples

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Embodiment Construction

[0048] Reference will now be made to the attached Figures 1 to 8B The present disclosure is described, and preferred example embodiments of the disclosure are illustrated in the accompanying drawings. However, the present disclosure may be embodied in other forms and should not be construed as limited to the embodiments / examples disclosed herein. The disclosed embodiments are provided to fully convey the scope of the present disclosure to those skilled in the art. Like reference numerals refer to like elements throughout. Therefore, similar elements will not be described in detail with respect to the description of each drawing. It should also be noted that the drawings are only intended to aid the description of the embodiments. They are not intended to be exhaustive descriptions of the claimed invention or to limit the scope of the claimed invention. Additionally, the illustrated embodiments do not necessarily have all the aspects or advantages shown. An aspect or adva...

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PUM

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Abstract

The present disclosure relates to a headband of a headphone and a method of assembling a headband for a headphone. A headband (10) for a headphone (100), the headband (10) comprising a first strip (20) and a second strip (30) that are detachably assembled together. The first strip (20) comprises at least one through-hole (23, 24, 25) via which the second strip (30) is detachably connected as a cover to the first strip. The second strip comprises first and second portions (33, 34) at least partially covering the first strip. The present disclosure further relates to a headphone (100) comprising a headband (10) and a method of assembling a headband (10) for a headphone (100).

Description

technical field [0001] The present disclosure relates to a headband for a headset and a method of assembling the headband for a headset. More particularly, the present disclosure relates to a headband for a headset, a headset and a method of assembling a headband for a headset as defined in the introductory part of the independent claims. Background technique [0002] EP 2566191 A2 and US 2016 / 0277828 A1 disclose a headset / headphone that allows the wearer to personalize by inserting various interchangeable trim strips into the headband of the headset / headphone Customized Headset / Headset. [0003] The problem with the prior art solutions is that the headband consists of a number of different interconnected parts, thereby complicating the interchange of the headband and its appearance. Therefore, there is a need to improve the replaceability of the headband of the headset. SUMMARY OF THE INVENTION [0004] It is an object of the present disclosure to alleviate, alleviate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10H04R31/00
CPCH04R1/1058H04R1/1075H04R1/1066H04R31/00H04R1/105H04R1/1008
Inventor 林启军黄春莲乔恩·格拉内·马德森曾建文赵宗毅
Owner GN AUDI GMBH
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