Structure of heat transfer printing element and manufacturing method thereof
A manufacturing method, thermal transfer printing technology, applied in printing and other directions
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[0033] The thermal transfer element of the present invention has a structure formed by micromachining technology such as figure 2 As shown, the thermal transfer element includes a substrate 20, on which a plurality of grooves 22 are opened, and a micro-heater 24 is suspended on each groove 22, and on the substrate 20, a micro-heater is located. A covering structure 28 is provided above the micro heaters 24 with a gap 26 to cover the micro heaters 24 .
[0034] The method for forming the above-mentioned thermal transfer element structure by micromachining technology in the present invention is as follows, please refer to figure 2 . First, a substrate 20 is provided, the material of which is usually single crystal silicon with a crystal orientation [100]. A plurality of grooves 22 are formed by silicon anisotropic etching, which is completed by using tetramethylammonium hydroxide (TMAH) etching solution; Device 24, which is a floating bridge structure (Floating Bridge Struc...
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