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Structure of heat transfer printing element and manufacturing method thereof

A manufacturing method, thermal transfer printing technology, applied in printing and other directions

Inactive Publication Date: 2006-03-08
XIANGQUN SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Another object of the present invention is to make the micro-heaters of the thermal transfer element have an excellent thermal insulation effect and the pitch (pitch) reaches below 40 microns, so as to overcome the thermal coupling problem between the existing heating resistors, Further provide high-resolution printing components with a resolution of more than 600dpi

Method used

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  • Structure of heat transfer printing element and manufacturing method thereof
  • Structure of heat transfer printing element and manufacturing method thereof
  • Structure of heat transfer printing element and manufacturing method thereof

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Embodiment Construction

[0033] The thermal transfer element of the present invention has a structure formed by micromachining technology such as figure 2 As shown, the thermal transfer element includes a substrate 20, on which a plurality of grooves 22 are opened, and a micro-heater 24 is suspended on each groove 22, and on the substrate 20, a micro-heater is located. A covering structure 28 is provided above the micro heaters 24 with a gap 26 to cover the micro heaters 24 .

[0034] The method for forming the above-mentioned thermal transfer element structure by micromachining technology in the present invention is as follows, please refer to figure 2 . First, a substrate 20 is provided, the material of which is usually single crystal silicon with a crystal orientation [100]. A plurality of grooves 22 are formed by silicon anisotropic etching, which is completed by using tetramethylammonium hydroxide (TMAH) etching solution; Device 24, which is a floating bridge structure (Floating Bridge Struc...

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Abstract

The present invention provides a structure of thermal transfer printing element and its manufacture method. It is characterized by that on a base plate are formed several recessed grooves, and on every recessed groove a microheater is formed, it is supported by several pivots and suspended and placed on the base plate, and on the base plate a covering mechanism is positioned over microheater and spaced at a certain gap so as to cover every microheater, so that said invention can effectively reduce heat consumption due to solid heat conduction between microheater and base plate, and has the effect of low power consumption and high resolution.

Description

technical field [0001] The invention relates to a thermal transfer element, in particular to a thermal transfer element formed by micro-processing technology, which is used in the printing market with low power consumption and high resolution. Background technique [0002] Press, the existing Thermal Printing Head (Thermal Printing Head, TPH) transfers the dye on a black or colored ribbon to paper by thermal energy to form text or image printing. Different from the printing technology of the inkjet head, the thermal transfer element can provide quite good grayscale effect by controlling the transfer temperature, especially in the printing of color photos, which can provide a quality closer to that of traditional developed photos. [0003] The structural cross-sectional view of the existing thermal transfer element is as follows figure 1 As shown, it includes a substrate 10, which is commonly used as a ceramic substrate with good thermal conductivity, and a thermal insulatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41J2/335B41J2/355
Inventor 周正三
Owner XIANGQUN SCI & TECH