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Heat-dissipating gain-type conductor holder

A lead frame and wire technology, applied in the lead frame field, can solve problems such as difficulty in steps, and achieve the effect of improving direct heat dissipation and avoiding tilt or offset

Inactive Publication Date: 2006-04-05
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the relative position of the chip holder 14 and the bottom pad 17 and the form of the opening 22 in the middle of the chip holder 14, it is necessary to control the coating and placement of the chip adhesive layer 24 (such as silver glue) on the chip holder 14 during the chip packaging process. The step of fixing the chip 13 on the chip holder 14 is difficult

Method used

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  • Heat-dissipating gain-type conductor holder
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  • Heat-dissipating gain-type conductor holder

Examples

Experimental program
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Effect test

no. 1 Embodiment

[0026] see Figure 2a , Figure 2a It is a partial perspective view of the lead frame 10 of the present invention (for the sake of clarity, the symmetrical structure of another part of multiple pins is not shown in the figure), the lead frame 10 of the present invention is suitable for being arranged in a package body 11, The semiconductor chip 13 is electrically connected through the wire 12 , wherein the lead frame 10 includes: a chip holder 14 , a bottom pad 17 , at least one connecting portion 18 and a plurality of pins 19 .

[0027] see Figure 2b , Figure 2b In order to show the cross-section (along Figure 2a XX" line) schematic diagram of the lead frame 10, wherein the above-mentioned chip holder 14 is arranged in the above-mentioned package body 11, and has a first surface 15 and a second surface 16 opposite to the above-mentioned first surface 15, and the above-mentioned first surface 15 For placing the above-mentioned chip 13 (for example, using silver glue as ...

no. 2 Embodiment

[0032] see Figure 3a , Figure 3aIt is a partial perspective view of the lead frame 10 of the present invention (for the sake of clarity of description, the symmetrical structure of another part of multiple pins is not shown in the figure), the lead frame 10 of the present invention is suitable for being arranged in the package body 11, through The wire 12 is electrically connected to the semiconductor chip 13 , wherein the lead frame 10 includes: a chip holder 14 , two bottom pads 17 , at least one connecting portion 18 and a plurality of pins 19 .

[0033] see Figure 3b , Figure 3b In order to show the cross-section (along Figure 3a The XX" line of the lead frame 10) schematic diagram, the above-mentioned chip holder 14 is arranged in the above-mentioned package body 11, and has a first surface 15 and a second surface 16 opposite to the above-mentioned first surface 15, and the above-mentioned first surface 15 For placing the above-mentioned chip 13 (for example, usi...

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Abstract

The heat-dissipating gain-type wire holder is suitable for being set inside one package and connected via wire to semiconductor chip. It includes one chip seat set inside the package and with two opposite sides including the first side for the chip to be set; one bottom mat around the chip seat and with parts stretching beyond the package; at least one containing part for connecting the chip seat and the bottom mat; and set lead pins with one part connected electrically to the semiconductor chip and one part exposed beyond the package.

Description

technical field [0001] The invention relates to a lead frame, and in particular to a heat dissipation gain type lead frame and its semiconductor packaging structure. Background technique [0002] As electronic components such as transistors, resistors, and capacitors increase in semiconductor chips, the heat generated by semiconductor chips also increases. How to effectively dissipate heat from semiconductor chips is a concern of modern semiconductor package and system designers. In order to solve the heat dissipation problem, the most commonly used method in the industry is to embed the heat sink in the semiconductor package, so that the heat sink is in direct contact with or close to the semiconductor chip. In some cases, exposing the surface of the heat sink to the outer surface of the package is more effective. Effectively transfer the heat generated by the semiconductor chip to the air through the heat sink. [0003] In any case, in order to increase heat dissipation ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L23/28
CPCH01L2224/48091H01L2224/73265H01L2224/48247
Inventor 李睿中蔡振荣林志文
Owner MACRONIX INT CO LTD