Leadless semiconductor package structure and combination thereof for improving heat dissipation

Abstract

The invention discloses a radiating-enhanced outer pin-free semiconductor packaging structure and a combination thereof. The radiating-enhanced outer pin-free semiconductor packaging structure comprises a lead frame, a first chip, a plurality of first boding wires and a sealing colloid, wherein the lead frame consists of a hollow chip bearing base and a plurality of pins and has a hollow heat convection region; the first chip is arranged on the chip bearing base to align with and cover the hollow heat convection region, and has a plurality of first electrodes; the plurality of first bonding wires connected with the first electrodes to the pins; and the sealing colloid seals the first chip and the first bonding wires to combine the pins with the chip bearing base, and the external surface of the pins and the hollow heat convection region are exposed at the bottom of the sealing colloid, so that the back of the first chip is provided with a central exposure region without being sealed by the sealing colloid. The invention also provides a combination applying the radiating-enhanced outer pin-free semiconductor packaging structure, which also comprises a printed circuit board and a solder. The radiating-enhanced outer pin-free semiconductor packaging structure radiates in a heat convection mode. The radiating efficiency cannot be influenced due to miniaturization, and the temperature of the printed circuit board jointed by the surface cannot be increased.

Description

technical field [0001] The invention relates to a semiconductor device, in particular to a semiconductor packaging structure without external pins for improving heat dissipation and a combination thereof. Background technique [0002] The lead-less type semiconductor package structure is a lead frame base semiconductor package structure that can conform to a small-sized package. The leadless semiconductor package structure is usually soldered to an external printed circuit board by using the outer surface of the lead on the bottom surface, and can be applied to various electrical products, such as notebook computers, mobile phones or personal digital assistants (PDAs), etc. . Since the chip emits high heat during operation, if the heat is not dissipated in time, it will definitely affect its normal operation, resulting in a decrease in execution speed or even affecting its service life. Traditionally, the technical means to solve the problem of heat dissipation is generall...

AI Technical Summary

Problems solved by technology

The heat dissipation effect of this kind of heat conduction is closely related to the area size of the lower surface 112 of the chip holder 110. When the pinless semiconductor package structure 100 is miniaturized, the lower surface 112 of the chip holder 110 will also become smaller. Small, resulting in poor heat dissipation

[0006] In addition, this heat dissipation method of heat conduction will also increase the temperature of the printed circuit board 10 and the solder 21, 22, causing the printed circuit board 10 and other components connected to the printed circuit board 10 (such as passive components or other integrated circuit components) ) produce functional decline or deterioration

In addition, the printed circuit board 10 needs to be designed to have the heat conduction holes 13 and the heat conduction blocks 16 and 17, and the heat conduction holes 13 must also be filled with a heat conduction material 30 so that the heat can be transferred to and dispersed In this printed circuit board 10, so the manufacturing method of this printed circuit board 10 is more complicated and cost increases

[0007] It can be seen that the above-mentioned existing non-outer pin type semiconductor packaging structure and its combination obviously still have inconvenience and defects in structure and use, and need to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

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