Functional module with built-in flat plate type radiating element

Abstract

The present invention provides a functional module with built-in plate radiating element. It includes a first circuit board, a second circuit board and a plate radiating element, in which said first circuit board has a first surface and on the first surface a first grounding layer is set, the second circuit board is coupled with first circuit board, and has a second surface, and said second surface is opposite to the first surface, and on the second surface a second grounding layer is set, said plate radiating element is placed between the first circuit board and second circuit board in the mode of respectively connected with first grounding layer and second grounding layer.

Description

technical field [0001] The invention relates to a functional module, in particular to a functional module with a built-in flat heat dissipation element. Background technique [0002] With the advancement of semiconductor manufacturing technology, the operation speed of electronic components is getting faster and faster, and more functions are integrated into a single component, thus causing design difficulties in component heat dissipation, signal quality, and electromagnetic radiation prevention and control. [0003] Generally speaking, electronic components are usually connected to each other through circuit boards. In computer systems, central processing unit (CPU), chipset (Chipset), graphics processing unit (GPU) or graphics interface (AGP), Electronic components such as dynamic random access memory (DRAM) are arranged on the motherboard made of printed circuit boards, and are arranged in different areas on the motherboard. The above-mentioned electronic components all...

AI Technical Summary

Problems solved by technology

In order to effectively solve the heat dissipation problem of these high-heating components on the motherboard at the same time, the above-mentioned solutions can no longer meet such heat dissipation requirements, so more efficient heat dissipation components must be introduced

However, these more efficient heat dissipation elements are usually only suitable for flat surfaces. The high heating components on the motherboard, and how to solve the problem of height difference between the high heating components on the motherboard

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