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Optical and electrical interconnect

A technology of interconnection and device optics, applied in the direction of electrical components, optical components, optics, etc.

Inactive Publication Date: 2007-05-16
INTEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Second, electrical interconnects have a finite resistance which, when coupled to parasitic capacitance, limits the speed at which information can be transferred across the interconnect

Method used

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  • Optical and electrical interconnect
  • Optical and electrical interconnect
  • Optical and electrical interconnect

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Embodiment Construction

[0015] In the following detailed description of the invention, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration specific embodiments of the invention as it may be practiced. In the drawings, like numerals illustrate substantially similar parts throughout the several views. These embodiments are described in sufficient detail to enable those of ordinary skill in the art to practice the invention. Other embodiments may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the present invention. The following detailed description is not to be read in a limiting sense, and the scope of the invention is to be defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled.

[0016] FIG. 1A is a perspective view of one embodiment of an interconnect 100 in accordance with the teachings of the present invention. I...

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Abstract

An interconnect comprising an anisotropic conductive film and an optically transmissive unit embedded in the anisotropic conductive film. The optically transmissive unit provides an optically transmissive path through the anisotropic conductive film. In an alternative embodiment, an electronic package comprises a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect comprises an anisotropic conductive film for electrically coupling a first conductive element formed on the first substrate to a second conductive element formed on the second substrate and one or more optically transmissive units embedded in the anisotropic conductive film. At least one of the one or more optically transmissive units couples an optical signal path on the first substrate to an optical receiver on the second substrate.

Description

technical field [0001] The present invention relates to connecting signals between substrates in electronic packages, and more particularly, to interconnects for connecting electrical and optical signals between substrates in electronic packages. Background technique [0002] Electrical interconnects are conductive structures that carry signals and information in modern electronic systems, such as computers, cellular telephones, and personal digital assistants. Substrates, including die and package substrates, are the building blocks of modern electronic systems. Diets are electronic components composed of diodes, transistors, resistors, capacitors and inductors used to perform electronic functions required in modern electronic systems. The packaging substrate provides a platform for mounting and interconnecting die and other electronic components, such as resistors, capacitors, and inductors. Electrical interconnects connect together the electronic components on and betwe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/43H01L21/00G02B6/12G02B6/125
CPCG02B6/125G02B2006/12069
Inventor K·拉J·麦克法兰德
Owner INTEL CORP