Wafer automatic alignment method

Abstract

The method is applicable to the cutting machine. With the master slice of water being aligned and collected by the manual adjustment manner, one group of the subsamples with least residue is selected through the zero adjustment, the sampling, the calculating residue of the spacing interval and the judgement procedures. The cutting worktable of the cutting machine is driven to rotate around the Z-axis, to shift along the X-axis as well as the camera of the cutting machine is shifted along the Y-axis. Thus, the subsequent other wafers can be automatically aligned through the said seven procedures.

Description

【Technical field】 [0001] The present invention relates to a method for wafer alignment, in particular to a method for automatic alignment of wafers which can be quickly and automatically aligned. 【Background technique】 [0002] Asia is now the key area of ​​the world's wafer foundry processing. However, with the increasingly fierce global competition, how to complete and deliver products to customers in the shortest time has become a very important issue. [0003] A conventional method for manually aligning wafers is to use with a wafer dicing machine 100. As shown in FIGS. 1, 2, and 3, the dicing machine 100 has: A self-rotating cutting table 1 for placing a wafer 101; a set of cutter shafts 2 and cameras 3 that can move back and forth along the Y-axis direction synchronously, and the cutter shaft 2 can move up and down along the Z-axis direction independently, and A blade 201 is provided; a central processing unit 4 that can control and drive the cutting table 1, the cutt...

AI Technical Summary

Problems solved by technology

[0008] Admittedly, this manual adjustment method cooperates with the auxiliary adjustment of the central processing unit 4 to achieve the purpose of aligning the wafer 101. However, this manual adjustment method needs to rely on the operator to visually observe the window 501 to complete. , and every time a chip is changed, it needs to be manually aligned again, so the speed is slow and time-consuming, so that the industry cannot effectively shorten the delivery time, and greatly affects the competitiveness of the industry

[0009] In order to solve the above-mentioned deficiency, Disco AbrasiveSystems, Ltd. (Disco AbrasiveSystems, Ltd.) introduces another cutting machine with double lenses. centimeter), by using the two lenses to take images at the same time, to shorten the time required for wafer alignment, but in actual use, because of the installation of two lenses, it will cause the overall cost of the cutting machine to increase , and if the size of the wafer to be cut is smaller than the gap, it cannot be applied, resulting in poor applicability

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