EMI shielding apparatus

A technology for shielding equipment, electronic equipment, applied in the direction of local shielding, magnetic/electric field shielding, electrical components, etc.

Inactive Publication Date: 2003-04-09
电子设备屏蔽公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the enclosure needs to be opened for refinishing or refurbishment, it is understood that some conductive connections will be degraded by the act of removal

Method used

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  • EMI shielding apparatus
  • EMI shielding apparatus
  • EMI shielding apparatus

Examples

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Embodiment Construction

[0034]Referring to FIG. 1, the electronic package component 20 of a cellular phone is a typical crab shell package design, which is shown in an assembled structure, as it will be used. FIG. 2 shows an exploded view of the electronic packaging component 20, including a bottom packaging shell 10 and a top packaging shell 12. The bottom package housing 10 includes a flange mesh 11 and a plurality of spiral bosses 14. The electronic packaging component 20 is fastened together by a plurality of screws 18 and a plurality of spiral bosses 14. This tightening method is well-known in the field of electronic packaging design technology, so some details are omitted to focus on the present invention. The electronic packaging component 20 also includes an EMT / RFI shielding device component 24, which is composed of an EMI / RFI shielding device 21 coated with a conductive coating 22, a printed circuit board 32, a plurality of electronic components 36 and a liquid crystal display 44, Among them, t...

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Abstract

An EMI and RFI shield mounting system (24) includes a compartmented EMI shield (21) constructed of a vacuum metallized thermoform (22) having upright hollow walls separating and surrounding the compartments (13). The shield (21) conforms to the interior of a housing (20) for electronic equipment (30), with the upright walls (29) overlying ridges formed in the interior of the housing (20). A compressible gasket (25) is placed between the ridges of the housing and the inner reaches of the hollow walls (31) of the shield (21). The free sides of the walls (29) of the shield (21) may be abutted against ground traces (46) on a printed circuit board (32) on which the shield (21) and housing (20) are placed. The gasket (25) urges the metallized free edges of the walls (20) of the shield (21) against the ground trace (46) of the printed circuit board to provide electrical conductivity between the printed circuit board and the shield (21). Dimples (60), tabs (52) or protruding punctures may be formed in the free sides of the walls (29) to ensure conductive contact with the ground trace (46).

Description

[0001] Cross references to related applications [0002] This application requests the rights of a US provisional patent application titled "EMI and RFI Shielding Methods for Electronic Packaging". The serial number of the application is 60 / 158,435, and the filing date is October 12, 1999, which is hereby incorporated by reference. All public content of the application. Technical field [0003] The present invention relates to a shielding device for shielding high-frequency electromagnetic radiation in personal computers, cellular phones or other electronic devices. Background technique [0004] Electromagnetic compatibility (EMC) is a broad term used to describe electromagnetic interference (EMI), radio frequency interference (RFI) and electrostatic discharge (ESD), and the above terms are usually used interchangeably. [0005] Electronic equipment is both a source of EMI and a receiver of EMI, which has two problems. Since electromagnetic radiation passing through the device may...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/38H05K9/00
CPCH05K9/0039H05K9/003H04B1/3838H05K9/0084Y10T428/24521Y10T428/24545
Inventor 约翰·F·加博沃
Owner 电子设备屏蔽公司
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