Equipment and method for making electric connector
A technology of electrical connection and connection unit, which is applied in the direction of connection, fixed connection, printed circuit manufacturing, etc., and can solve problems such as weakening and increasing costs
Inactive Publication Date: 2004-05-12
AVX CORP
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- Abstract
- Description
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- Application Information
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Problems solved by technology
This sometimes increases the cost of such parts
Furthermore, variations or voids in such base units can undesirably weaken the unit
Method used
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[0056] Now describing various embodiments of the invention, one or more examples of the embodiments are described below. Each example is given by way of explanation of the invention only, not limitation of the invention. In fact, those skilled in the art will recognize that various modifications and variations can be made in the present invention without departing from the scope or spirit of the invention.
[0057] go to figure 1 , shows a connector array 20 comprising a first insulating substrate 21 positioned in a matching configuration with a second insulating substrate 25 . Such as figure 1 As shown, first insulating substrate 21 includes a plurality of solder portions, such as solder portions 22a-b (also referred to as "solder balls" or "solder bumps"), on a first side 28 thereof. Likewise, the second insulating substrate 25 is on the second side 29 (see Figure 1A )Include figure 1 There are a plurality of solder portions not shown, which are located under the secon...
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Abstract
A method and apparatus for manufacturing an electrical connection unit and connector array is provided. Such arrays may be used to solder together traces from opposed circuit boards, in which the array is fitted between, and soldered to the boards to complete a circuit. The method of manufacturing a connection unit includes providing a first insulative base with one or more contacts or contact groups extending from the first side towards the second side of the base. Solder portions or solder balls may be reflowed to contacts at their termination points. An apparatus and method may provide a solder positioning device or means on top of or adjacent to the first insulative base, so that solder portions or solder balls are placed within cavities in the positioning device, in alignment with apertures of the first insulative base. The connection unit may be heated to reflow and fuse the solder portions to the contact termination, thereby constructing an array.
Description
technical field [0001] The present invention relates to apparatus and methods for making electrical connectors, and more particularly, to an apparatus and method for making connectors utilizing a solder carrier applied from the bottom of an insulating substrate. Background technique [0002] Many different types of electrical connectors are provided for various purposes. In the computer and microelectronics industries, electrical connectors are provided as two separate parts designed to mate with each other. There is an incentive in the industry to provide smaller connectors. Connectors can be used to connect conductive traces from one board to another. Such connectors may provide a grid or array of connection points on opposing surfaces. The two-part connector can be electrically mated on mating surfaces and then mated to conductive traces of a circuit board on an opposing mounting surface. [0003] Ball grid array connectors typically use portions of solder known as "s...
Claims
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IPC IPC(8): H01R12/16H01R12/71H01R43/00H01R43/02H01R43/24H05K3/34H05K13/04
CPCH05K3/3426H01R43/24H01R12/57H05K13/0465H05K3/3478H01R43/0256Y10T29/49153Y10T29/49117Y10T29/49149Y10T29/49211Y10T29/49144Y10T29/49139Y10T29/49147Y10T29/49213
Inventor 约翰·J·阿什曼门罗·韦莫珍妮弗·哈蒙德
Owner AVX CORP