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Electronic component test device

A technology for electronic components and test devices, applied in the field of electronic test devices, can solve the problems of rising equipment costs, difficulty in ensuring the positioning accuracy of electronic components 20 and contact parts 110a, etc., achieve high throughput, ensure the number of simultaneous measurements, and ensure The effect of positioning accuracy

Inactive Publication Date: 2005-06-08
ADVANTEST CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In addition, it is also conceivable, for example, to divide the 32 contact parts 110a into several contact groups 110, and to set an independent moving mechanism in each contact group 110, so that the electronic component conveying medium 10 with as few sheets as possible can always ensure simultaneous movement. Measure the number, but if the contact group exceeds a certain level, it may become a cause of equipment cost increase
[0013] In addition, it is also conceivable, for example, to divide the 32 contact portions 110a into several contact groups 110, use one moving mechanism to move all the electronic component conveying media 10 together, and install a moving mechanism for testing, thereby ensuring the number of simultaneous measurements at all times. , but since many pieces of electronic component conveying medium 10 are held together, then along with the increase of the number of electronic component conveying medium 10, it will be difficult to ensure the positioning accuracy of each electronic component 20 and contact portion 110a.

Method used

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  • Electronic component test device
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Examples

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Embodiment Construction

[0055] Embodiments of the present invention will be described below with reference to the drawings.

[0056] (first embodiment)

[0057] figure 1 It is a schematic diagram of an electronic component testing device according to a first embodiment of the present invention, figure 2 It is a figure which shows the detailed structure of the test head 100 and its surroundings, and the control system of the electronic component testing apparatus of this invention.

[0058] The electronic component testing apparatus 1 of the present embodiment is to test (inspect) whether the electronic component 20 under test operates properly under the condition that a high-temperature or low-temperature temperature stress is applied to the electronic component 20 under test, and to test the electronic component 20 according to the test result. In the apparatus for sorting electronic components 20, the operation test in the state where such a temperature stress is applied is carried out by trans...

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Abstract

An electronic component test apparatus for performing a test by pressing the input / output terminals of tested electronic components against the contact parts of a test head part by a moving means with the tested electronic components mounted on electronic component feeding media, wherein two sheets of electronic component feeding media having the tested electronic components mounted thereon are held by one moving means and, at the same time, two sheets of electronic component feeding media having the tested electronic components mounted thereon are held by the other moving means, and each moving means carries in and out the electronic component feeding media independently to the contact groups.

Description

technical field [0001] The present invention relates to an electronic testing device for testing electronic components, and relates to an electronic component testing device capable of performing tests with high test efficiency by having a plurality of moving mechanisms that simultaneously hold and test a plurality of electronic component transport media carrying electronic components to be tested device. Background technique [0002] In an electronic component testing device called a handling device, a plurality of electronic components accommodated on trays are transported into the testing device, each electronic component is brought into electrical contact with a test head, and the electronic component testing device body (hereinafter also referred to as the tester) device) for testing. When the test is completed, each electronic component is sent out from the test head, and is switched to the tray corresponding to the test result, thereby classifying qualified products ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28H01L21/66
CPCG01R31/2886G01R31/28
Inventor 伊藤明彦中村浩人
Owner ADVANTEST CORP
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