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Device to cool integrated circuit element and disk drive having the same

A technology of integrated circuits and disk drives, which is applied in the direction of circuit heating devices, electrical components, printed circuit components, etc., and can solve problems such as ineffective transfer of heat and hindering heat transfer between integrated circuit components 2 and heat absorbers 4

Inactive Publication Date: 2005-07-13
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

but if figure 2 As shown, when the first surface 11 must be used as the mounting surface, since the printed circuit board 1 hinders the heat transfer between the integrated circuit element 2 and the heat absorber 4, the heat generated in the integrated circuit element 2 cannot be efficiently transferred To heat absorber 4

Method used

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  • Device to cool integrated circuit element and disk drive having the same
  • Device to cool integrated circuit element and disk drive having the same
  • Device to cool integrated circuit element and disk drive having the same

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Embodiment Construction

[0023] Embodiments of the invention will now be described in detail, examples of which are shown in the accompanying drawings, wherein like reference numerals refer to like elements throughout. The embodiments are described below in order to explain the present invention by referring to the figures.

[0024] Refer to attached image 3 and 4 , the printed circuit board 130 has a first surface 131 and a second surface 132 . The integrated circuit component 100 is mounted on the first surface 131 of the printed circuit board 130 . To this end, a mounting portion 133 for mounting the lead frame 101 of the integrated circuit element 100 is prepared on the first surface 131 of the printed circuit board 130 . In addition, a through hole 134 is formed on the printed circuit board such that when the integrated circuit device 100 is mounted on the printed circuit board 130, the first element surface 102 of the integrated circuit device 100 is exposed through the through hole 134. Th...

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Abstract

An apparatus for cooling an integrated circuit component, the apparatus comprising a printed circuit board having a through hole smaller than the integrated circuit component; a cooling pad attached to a first component surface of the integrated circuit component, which is located in the through hole; and a heat absorber attached The heat transfer part, which is in contact with the cooling pad, transfers heat to the heat absorber, so that the integrated circuit element mounted on the first surface of the printed circuit board is cooled by transferring the heat generated by it to the heat absorber, and the heat The absorber is arranged facing a second surface of the printed circuit board opposite to the first surface.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 2004-1106 filed with the Korean Intellectual Property Office on Jan. 8, 2004, the contents of which are incorporated herein by reference. technical field [0003] The present invention relates to a device for cooling integrated circuit components and a disc drive having the same, more particularly, to a device for cooling integrated circuit components and a disc drive having the same, wherein the device can be mounted on a printed circuit The first surface of the integrated circuits on the board transfers heat. Background technique [0004] attached figure 1 is a cross-sectional view of a conventional apparatus for cooling integrated circuit components. refer to figure 1 , components are mounted on the first surface 11 and the second surface 12 of the printed circuit board 1 . The heat absorber 4 is arranged relative to the second surface 12 of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G11B17/04G11B33/12G11B33/14H01L23/13H01L23/34H01L23/367H05K1/02H05K7/20
CPCG06F1/20G11B17/056G11B33/123G11B33/1426H01L23/13H01L23/3677H05K1/0204H05K7/20436H05K2201/09054H05K2201/10416H05K2201/10689H01L2924/0002H01L2924/00G06F1/16
Inventor 曹星旭
Owner SAMSUNG ELECTRONICS CO LTD