Wire bonding packaging body

Abstract

The invention provides a throwing jointing packaging body. It includes one shell body with many foot, one circuit board set in the shell body, no less than one crystal grain set on the circuit board, no less than welding cushion connected to the crystal grain, and joint lead wire on the circuit board. The joint leas wire can make the welding cushion on the crystal grain electronically connect to the food of the shell body.

Description

technical field [0001] The present invention relates to a wire bonding package, in particular to a wire bonding package in which dies can be electrically connected to pins on a housing via a circuit board. Background technique [0002] In the modern information society, microprocessor systems composed of integrated circuits have long been widely used in all aspects of life, such as personal computers, mobile communication equipment, and automatically controlled household appliances. The most important part is the die produced by the semiconductor manufacturing process. Die can be formed by a semiconductor manufacturing process: a wafer is cut into multiple regions, and various circuits are formed on individual regions to form the die. In addition to being directly electrically connected to a circuit board through the bare chip configuration method, the completed chip can also be packaged in a package in order to obtain the operating voltage or other data required for operat...

AI Technical Summary

Problems solved by technology

[0005] In addition, even if the first crystal grain 12 and the second crystal grain 14 have been redesigned before being arranged in the housing 16, the above-mentioned wire crossing situation will not occur, however, with the housing (for package) and the volume of the die is getting smaller and smaller, and the circuit in the die is becoming more and more complicated, the transmission is electrically connected to the pin 92 of the housing 16 and the die of the first die 12 Signals on the bonding wires 72 between the die bonding pads 82 are often transmitted between the pins 90 electrically connected to the housing 16 and the die bonding of the first die 12 due to the coupling effect caused by wire crowding. The effect of the signal on the bonding wire 70 between the pads 80 and indirectly affects the overall performance of the multi-die wire bonding package 10, especially when the signal transmitted on the bonding wire 72 is an analog signal.

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