Wire bonding packaging body

A technology of wire bonding and packaging, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems affecting the overall performance of multi-chip wire bonding package 10, and save production time and cost, improve overall performance, and avoid coupling effects
CN1641869AActive Publication Date: 2005-07-20ALICORP
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
ALICORP
Publication Date
2005-07-20

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Abstract

The invention provides a throwing jointing packaging body. It includes one shell body with many foot, one circuit board set in the shell body, no less than one crystal grain set on the circuit board, no less than welding cushion connected to the crystal grain, and joint lead wire on the circuit board. The joint leas wire can make the welding cushion on the crystal grain electronically connect to the food of the shell body.
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Description

technical field

[0001] The present invention relates to a wire bonding package, in particular to a wire bonding package in which dies can be electrically connected to pins on a housing via a circuit board. Background technique

[0002] In the modern information society, microprocessor systems composed of integrated circuits have long been widely used in all aspects of life, such as personal computers, mobile communication equipment, and automatically controlled household appliances. The most important part is the die produced by the semiconductor manufacturing process. Die can be formed by a semiconductor manufacturing process: a wafer is cut into multiple regions, and various circuits are formed on individual regions to form the die. In addition to being directly electrically connected to a circuit board through the bare chip configuration method, the completed chip can also be packaged in a package in order to obtain the operating voltage or other data required for operat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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