Method and equipment for mounting part

A technology of installation device and installation method, which is applied in the direction of electrical components, electrical components, etc., can solve the problems of narrowing and restriction of nozzle opening area, and achieve the effect of avoiding waste and preventing defective circuit substrates

Inactive Publication Date: 2005-09-14
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this connection, the area of ​​the nozzle opening through which the air is sucked or blown is narrowed, whereby the amount of vacuum air or compressed air passing through the nozzle is limited
Accordingly, the degree of occurrence of failures during suction and mounting operations tends to increase recently

Method used

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  • Method and equipment for mounting part
  • Method and equipment for mounting part
  • Method and equipment for mounting part

Examples

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Embodiment Construction

[0063] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. A first embodiment of the invention relates to a method and apparatus for mounting components with a process or means for detecting missing components through a nozzle. figure 1 An overall view of the component mounting device according to the present invention is shown. now refer to figure 1 , the component mounting apparatus 100 has a loader 7 for loading the circuit substrate 5 into the component mounting apparatus 100 , the loader 7 is located on the right-hand side of the base 3 in the X direction. Opposite to the loader 7 on the left-hand side in the X direction, the component mounting apparatus 100 has an unloader 9 for unloading a circuit substrate from the component mounting apparatus 100 . The loader 7 and the unloader 9 respectively have a pair of guide rails 11 and 13 arranged for conveying the circuit substrate 5 .

[0064] A first substr...

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Abstract

The present invention is to provide a method and an apparatus for mounting components having a feature of detecting with high accuracy component pick up failure by the nozzle at component pick up stage, and / or component carrying back by the nozzle at component mounting stage. Achieved vacuum pressure is initialized to zero after completion of component pick up by the nozzle 25 , and vacuum pressure decrease of the nozzle 25 is detected from the initialized zero point. If the detected value is bigger than the predetermined threshold, it may be judged that at least one of the nozzles failed to pick up a component. The failed nozzle may be identified by using a component recognition device 37 . Blowing air blow volume flowing through the nozzle 25 is measured upon completion of component mounting. If the blowing air flow is smaller that the predetermined threshold, it is judged that the nozzle 25 carries back a component 30 . Two thresholds may be used, and it may be judged that the component has been properly mounted if the measurement value is bigger than both thresholds, filter 22 is clogged if the measurement value is in between the two thresholds, and the nozzle 25 carries back the component if the measurement value is smaller than both thresholds.

Description

technical field [0001] The present invention relates to a method and an apparatus for mounting components by picking up components such as electronic components from a component supply source and mounting the components on respective predetermined positions on a circuit substrate. Specifically, the present invention relates to a method and an apparatus for mounting components, including the following processes: detecting whether a nozzle for picking up a component fails to pick up a component during the If the stage did not successfully install the element and bring back said element. Background technique [0002] A component mounting apparatus having a nozzle for picking up components by a suction effect generated by vacuum pressure includes: a component supply source for continuously supplying components to the component mounting apparatus; One or more nozzles for picking up components from a component supply and mounting said components onto a circuit substrate; transfer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H05K13/08
CPCH05K13/08Y10T29/4913Y10T29/49004Y10T29/53174H05K13/0408Y10T29/53191Y10T29/49131H05K13/0409H05K13/082
Inventor 前田刚奥田修内山宏矢泽隆今川宏明长泽阳介平井弥中岛诚纐缬尚人
Owner PANASONIC CORP
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