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Microphone device

A microphone and chamber technology, applied in electrical components, sensors, etc., can solve problems such as inability to flatten and limit the thickness of the microphone device 1

Inactive Publication Date: 2005-12-14
HIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when this kind of microphone device 1 is installed on the main circuit board 22, because the annular sealing portion 16 has a certain thickness, and the conductive gel 21 also occupies a certain thickness, thus limiting the installation of the microphone device 1 on the main circuit. The overall thickness of the plate 22 cannot make it more flattened after assembly

Method used

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Examples

Experimental program
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Embodiment Construction

[0015] refer to image 3 and Figure 4 A preferred embodiment of the microphone device 3 of the present invention includes a housing 31, a top plate 32, an upper gasket 33, a vibrating membrane 34, a lower gasket 35, an annular cavity 36, an induction substrate 37, an The conductive ring 38, and a signal generating unit 39.

[0016] The casing 31 has a ring-shaped main shell portion 312 defining a chamber 311 , and a sealing portion 313 extending inward along a top edge of the main shell portion 312 . The top plate 32 is connected to the lower side of the sealing portion 313 of the housing 31 to block the chamber 311 , and the top plate 32 has a plurality of through holes 321 . It should be noted that the sealing portion 313 is formed by pressing the top end of the casing 31 inward with a shrinking knife (not shown) after the top plate 32 is disposed in the chamber.

[0017] The upper gasket 33 is annular and located in the chamber 311 , and is disposed on the lower side of...

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PUM

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Abstract

The present invention discloses one kind of microphone device. The microphone device includes one ring casing to define one holding chamber, and one top board, one ring upper pad, one vibration membrane, one ring lower pad, one inducing base board to sense the vibration of the vibration membrane and one conducting ring arranged successively from top to bottom inside holding chamber. The microphone device includes also one microphone circuit board in the lower part of the casing. The conducting ring has its upper side and the lower side connected separately to the inducing base board and the microphone circuit board. The microphone circuit board is contacted with and electrically connected with the electronic product to be combined without gap in between.

Description

technical field [0001] The invention relates to a microphone device, in particular to a flattened microphone device connected to a circuit board without gaps. Background technique [0002] refer to figure 1 , 2 , the general microphone device 1 comprises a housing 11 that defines a downwardly open accommodating space 111, and an annular partition 12 that defines a front space 121 that is sequentially arranged in the accommodating space 111 from top to bottom , a vibrating membrane 13 blocked under the annular partition 12, an annular gasket 19 arranged under the vibrating membrane 13, an annular cavity 14 located below the annular gasket 19 and defining a cavity 141, an annular cavity 14 located in the hollow In the cavity 141 and connected to the sensing substrate 15 below the annular gasket 19, a conductive ring 18 arranged in the cavity 141 and below the sensing substrate 15 and electrically connected to the sensing substrate 15, and blocked in the annular cavity 14 Be...

Claims

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Application Information

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IPC IPC(8): H04R9/08
Inventor 潘俊弟张世宏张家庆
Owner HIT