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Thermal module and manufacturing method thereof

A technology of heat dissipation module and heat dissipation device, which is applied in heat exchange equipment, lighting and heating equipment, heat transfer modification, etc. The effect of safe heat dissipation and stable contact thermal resistance

Inactive Publication Date: 2006-02-15
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of unstable contact thermal resistance and unsafe heat dissipation between the heat dissipation fin base and the heating element of the prior art heat dissipation device, the purpose of the present invention is to provide a stable contact thermal resistance between the heat dissipation fin base and the heating element , Thermally safe cooling module

Method used

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  • Thermal module and manufacturing method thereof
  • Thermal module and manufacturing method thereof
  • Thermal module and manufacturing method thereof

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Embodiment Construction

[0026] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0027] see figure 1 and figure 2 The heat dissipation module provided by the present invention includes: a heating element 10; a heat dissipation device 50 including a base 51 and a plurality of heat dissipation fins 52 extending from the base 51; a thermal interface material 30 between the base 51 and the heating element 10 And a porous film 20; wherein, the porous film 20 is disposed around the thermal interface material 30, and the holes 23 of the porous film 20 have carbon nanotubes 28 growing therein.

[0028] The heating element 10 includes electronic devices such as a central processing unit (CPU), a power transistor, a video graphics array chip (VGA), and a radio frequency chip. In this embodiment, the heating element 10 is a central processing unit (CPU).

[0029] The heat sink 50 includes air-cooled radiators, water-cooled radiators, heat pipe ra...

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Abstract

This invention relates to heat sink mould group, which comprises a heating element, a heat sink device composed of a base and prolonged some radiating fins, thermal interfacial material sealed among the base, thin membrane and heating element to prevent itself volatilization or overflow and ensure security, and porous thin membrane around the interfacial material with carbon nano pipe benefit to decrease contact thermal resistance. The invention also provides the corresponding manufacture method.

Description

【Technical field】 [0001] The invention relates to a heat dissipation module and a preparation method thereof, in particular to a heat dissipation module with a thermal interface material between a heating element and a radiator and a preparation method thereof. 【Background technique】 [0002] At present, the existing heat dissipation methods for semiconductor devices such as CPU and other heating elements mainly use air convection cooling, and radiators with heat dissipation fins are the most widely used. [0003] Initially, the contact mode between the heat sink and the heating element is usually that the heat dissipation fin base is in direct contact with the heating element. The Chinese mainland patent with the announcement number CN2253493Y published on April 30, 1997 discloses a cooling device, which is mainly made of cooling fins with a fan. The air convection is formed by the fan, and the heat is conducted from the cooling fins to the surrounding air to improve the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/34G06F1/20
CPCB82Y10/00F28F2013/006H01L23/373F28F13/00H01L23/433H01L23/3733H01L2924/0002H01L2924/00
Inventor 颜士杰林国隆
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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