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Semiconductor circuit, semiconductor device, and method for testing same semiconductor circuit

An inspection method and semiconductor technology, which can be applied to semiconductor devices, circuits, measuring devices, etc., and can solve problems such as the effect of reducing the device and the complexity of the circuit.

Inactive Publication Date: 2006-10-25
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the more the number of resistors increases, the more the number of input terminals increases, the circuit becomes complicated, and there is a problem that the effect of reducing the size of the device cannot be expected.

Method used

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  • Semiconductor circuit, semiconductor device, and method for testing same semiconductor circuit
  • Semiconductor circuit, semiconductor device, and method for testing same semiconductor circuit
  • Semiconductor circuit, semiconductor device, and method for testing same semiconductor circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0029] if according to figure 1 One embodiment of the present invention will be described as follows up to FIG. 3 .

[0030] figure 1 It is a figure which shows one embodiment of this invention, and shows the circuit structure of the semiconductor detection circuit (semiconductor circuit) 10.

[0031] The semiconductor detection circuit 10 includes: a detection terminal TEST, a first resistance element R1, a second resistance element R2, a first diode (first switch part) D1, a second diode (second switch part) D2, a first Fixed potential point 11 , second fixed potential point 12 and connection point 13 . The semiconductor detection circuit 10 is installed in a semiconductor device, and measures the respective resistance values ​​of a resistor designed to have the same resistance value as the first resistor element R1 used in the semiconductor device and a resistor designed to have the same resistance value as the second resistor element R2. What kind of resistance value ...

Embodiment approach 2

[0074] according to Figure 4 Another embodiment of the present invention will be described as follows.

[0075] This embodiment is an application example of the first embodiment. This embodiment and figure 1 ~Compared with the semiconductor detection circuit shown in FIG. 3, the structures of the first switch part and the second switch part are different, and the other structures are the same. In addition, the same code|symbol is attached|subjected to the structure and the structure which has the same function as what was demonstrated in the said embodiment, and the description is abbreviate|omitted.

[0076] Figure 4 This is an application example of Embodiment 1. Figure 4 is to indicate that there is a reduction figure 1 A circuit diagram of the semiconductor detection circuit 40 showing the structure of power consumption in the semiconductor detection circuit 10 shown.

[0077] Such as Figure 4 As shown, the semiconductor detection circuit 40 in the second embo...

Embodiment approach 3

[0087] according to Figure 5 - Fig. 7 When describing another embodiment of the present invention, it will be as follows.

[0088] Figure 5 One embodiment of the present invention is shown, and the circuit configuration of the semiconductor detection circuit 50 is shown.

[0089] The semiconductor detection circuit 50 includes: a detection terminal TEST, a first resistance element R1, a second resistance element R2, a resistance element Ra and a resistance element Rb for voltage division, a first transistor (first switch portion) Q1, a second transistor ( second switch part) Q2 , a first fixed potential point 51 , a second fixed potential point 52 , a connection point 53 and a connection point 56 .

[0090] This semiconductor detection circuit 50 is mounted in a semiconductor device. The semiconductor detection circuit 50 is manufactured to measure the respective resistance values ​​of the resistors having the same resistance value as the design of the first resistance elem...

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PUM

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Abstract

In the semiconductor circuit of the present invention, the first diode and the first resistance element are connected in series between the fixed potential point and the detection terminal. The second diode and the second resistance element are connected in series between the second fixed potential point and the detection terminal. By setting the power supply connected to the detection terminal, the current flowing through the first resistance element and the second resistance element is switched, and the current flowing through and measuring only one of the first resistance element and the second resistance element is turned on. Multiple currents can be detected with one terminal for the first resistance element and the second resistance element.

Description

technical field [0001] The present invention relates to a semiconductor circuit and a semiconductor device for inspection. In particular, it relates to a circuit and an inspection method for inspecting a semiconductor circuit including a plurality of resistance elements and a semiconductor device. Background technique [0002] Conventionally, for inspection of resistance formed on a semiconductor device, a semiconductor device provided with a plurality of terminals for detection has been widely used. Furthermore, semiconductor devices, especially integrated circuits, are increasingly required to have high functionality and high performance. In order to meet these requirements, there is an increasing use of multiple components where necessary. [0003] High resistance is required in circuits that require low current consumption and high sensitivity. Also, low resistance is required for circuits where large currents flow and circuits where current loss is to be reduced. If...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00G01R31/28H03K17/60H03K17/74
CPCG01R31/2884
Inventor 伊藤弘朗
Owner SHARP KK